購買 WR-383250-17M2-G與BYCHPS
購買即有保證
WR-383250-17M2-G
- 型號:
- WR-383250-17M2-G
- 製造商:
- TDK Corporation
- 描述:
- RX 1 COIL 1 LAYER BIFILAR 11.1UH
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19013 Pieces
簡單介紹
BYCHIPS是 WR-383250-17M2-G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的WR-383250-17M2-G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | 1 Coil, 1 Layer, Bifilar |
|---|---|
| 公差: | ±5% |
| 尺寸/尺寸: | 1.50" L x 1.26" W x 0.04" H (38.1mm x 32.0mm x 1.0mm) |
| 系列: | WR |
| Q因子@頻率: | - |
| 其他名稱: | 445-9309 WR38325017M2G |
| 工作溫度: | -30°C ~ 70°C |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | WR-383250-17M2-G |
| 電感: | 11.1µH |
| 功能: | Receiver |
| 頻率 - 自諧振: | - |
| 展開說明: | 1 Coil, 1 Layer, Bifilar 11.1µH Wireless Charging Coil Receiver 270 mOhm Max |
| 描述: | RX 1 COIL 1 LAYER BIFILAR 11.1UH |
| 直流電阻（DCR）: | 270 mOhm Max |
| 目前評級: | - |
| 電流 - 飽和: | - |
| Email: | [email protected] |
WR-383250-17M2-G的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers