購買 VSC3312YP與BYCHPS
購買即有保證
VSC3312YP
- 型號:
- VSC3312YP
- 製造商:
- Microsemi
- 描述:
- IC CROSSPOINT SW 12X12 196-FCBGA
- 無鉛狀態/ RoHS狀態:
- 含鉛/符合RoHS
- 庫存數量:
- 16316 Pieces
- 數據表:
- VSC3312YP.pdf
簡單介紹
BYCHIPS是 VSC3312YP的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的VSC3312YP購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓，單（V +）: | 2.5V |
|---|---|
| 電壓 - 雙通道（V±）: | - |
| 開關電路: | - |
| 供應商設備封裝: | 196-FCBGA (15x15) |
| 系列: | - |
| 封装: | Tray |
| 封裝/箱體: | 196-FCBGA |
| 工作溫度: | - |
| 通態電阻（最大值）: | - |
| 通道數: | 1 |
| 多路復用器/解復用器電路: | 12:12 |
| 濕度敏感度（MSL）: | 4 (72 Hours) |
| 製造商零件編號: | VSC3312YP |
| 特徵: | - |
| 展開說明: | Backplane, Cable Interconnect Switch IC 1 Channel 196-FCBGA (15x15) |
| 描述: | IC CROSSPOINT SW 12X12 196-FCBGA |
| 應用: | Backplane, Cable Interconnect |
| -3db帶寬: | - |
| Email: | [email protected] |
VSC3312YP的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers