購買 VSC3303YHV-01與BYCHPS
購買即有保證
VSC3303YHV-01
- 型號:
- VSC3303YHV-01
- 製造商:
- Microsemi
- 描述:
- 8.5 GBPS 4X4 CROSSPOINT SWITCH
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15540 Pieces
簡單介紹
BYCHIPS是 VSC3303YHV-01的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的VSC3303YHV-01購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓，單（V +）: | 1.8 V ~ 3.3 V |
|---|---|
| 電壓 - 雙通道（V±）: | - |
| 開關電路: | - |
| 供應商設備封裝: | 36-FCBGA (7x7) |
| 系列: | - |
| 封装: | Tray |
| 封裝/箱體: | - |
| 工作溫度: | -40°C ~ 110°C (TA) |
| 通態電阻（最大值）: | - |
| 通道數: | 1 |
| 多路復用器/解復用器電路: | 4:4 |
| 濕度敏感度（MSL）: | 4 (72 Hours) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | VSC3303YHV-01 |
| 特徵: | - |
| 展開說明: | Backplane, Cable Interconnect Switch IC 1 Channel 36-FCBGA (7x7) |
| 描述: | 8.5 GBPS 4X4 CROSSPOINT SWITCH |
| 應用: | Backplane, Cable Interconnect |
| -3db帶寬: | - |
| Email: | [email protected] |
VSC3303YHV-01的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers