購買 SI8900EDB-T2-E1與BYCHPS
購買即有保證
SI8900EDB-T2-E1
- 型號:
- SI8900EDB-T2-E1
- 描述:
- MOSFET 2N-CH 20V 5.4A 10-MFP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14262 Pieces
簡單介紹
BYCHIPS是 SI8900EDB-T2-E1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SI8900EDB-T2-E1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 1V @ 1.1mA |
|---|---|
| 供應商設備封裝: | 10-Micro Foot™ CSP (2x5) |
| 系列: | TrenchFET® |
| RDS（ON）（最大值）@標識，柵極電壓: | - |
| 功率 - 最大: | 1W |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 10-UFBGA, CSPBGA |
| 其他名稱: | SI8900EDB-T2-E1TR |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | SI8900EDB-T2-E1 |
| 輸入電容（Ciss）（Max）@ Vds: | - |
| 柵極電荷（Qg）（Max）@ Vgs: | - |
| FET型: | 2 N-Channel (Dual) Common Drain |
| FET特點: | Logic Level Gate |
| 展開說明: | Mosfet Array 2 N-Channel (Dual) Common Drain 20V 5.4A 1W Surface Mount 10-Micro Foot™ CSP (2x5) |
| 漏極至源極電壓（Vdss）: | 20V |
| 描述: | MOSFET 2N-CH 20V 5.4A 10-MFP |
| 電流 - 25°C連續排水（Id）: | 5.4A |
| Email: | [email protected] |
SI8900EDB-T2-E1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SI6969BDQ-T1-E3 | Vishay Siliconix | MOSFET 2P-CH 12V 4A 8TSSOP | 在線詢價 |
 |
GWM220-004P3-SL SAM | IXYS | MOSFET 6N-CH 40V 180A ISOPLUS | 在線詢價 |
 |
SI8901EDB-T2-E1 | Vishay Siliconix | MOSFET 2P-CH 20V 3.5A 6-MFP | 在線詢價 |
|
SI8902EDB-T2-E1 | Vishay Siliconix | MOSFET 2N-CH 20V 3.9A 6-MFP | 在線詢價 |
 |
IRF7343QTRPBF | Infineon Technologies | MOSFET N/P-CH 55V 8-SOIC | 在線詢價 |
 |
APTC60TAM35PG | Microsemi Corporation | MOSFET 6N-CH 600V 72A SP6-P | 在線詢價 |
 |
AON2801L | Alpha & Omega Semiconductor Inc. | MOSFET P-CH DUAL DFN | 在線詢價 |
|
SI8904EDB-T2-E1 | Vishay Siliconix | MOSFET 2N-CH 30V 3.8A 6-MFP | 在線詢價 |
 |
ALD110900SAL | Advanced Linear Devices Inc. | MOSFET 2N-CH 10.6V 8SOIC | 在線詢價 |
 |
SIA910EDJ-T1-GE3 | Vishay Siliconix | MOSFET 2N-CH 12V 4.5A SC-70-6 | 在線詢價 |
 |
SH8K1TB1 | Rohm Semiconductor | MOSFET 2N-CH 30V 5A SOP8 | 在線詢價 |
 |
AO4838 | Alpha & Omega Semiconductor Inc. | MOSFET 2N-CH 30V 11A 8SOIC | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers