購買 PEB 3324 E V1.4-G與BYCHPS
購買即有保證
PEB 3324 E V1.4-G
- 型號:
- PEB 3324 E V1.4-G
- 描述:
- IC CODEC VOIP 176-LBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18867 Pieces
簡單介紹
BYCHIPS是 PEB 3324 E V1.4-G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的PEB 3324 E V1.4-G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | - |
|---|---|
| 供應商設備封裝: | PG-LBGA-176 |
| 系列: | VINETIC® |
| 功率（瓦特）: | 400mW |
| 封装: | Tray |
| 封裝/箱體: | 176-LBGA |
| 其他名稱: | SP000108018 |
| 工作溫度: | -40°C ~ 85°C |
| 電路數: | 4 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商零件編號: | PEB 3324 E V1.4-G |
| 接口: | ADPCM |
| 包括: | Advanced Integrated Test and Diagnostic Functions (AITDF), Caller-ID Generator, DTMF Receiver, Line Echo Cancellation (LEC) |
| 功能: | Analog Voice Access |
| 展開說明: | Telecom IC Analog Voice Access PG-LBGA-176 |
| 描述: | IC CODEC VOIP 176-LBGA |
| 供電: | - |
| Email: | [email protected] |
PEB 3324 E V1.4-G的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog