購買 PEB 2466 H V2.2與BYCHPS
購買即有保證
PEB 2466 H V2.2
- 型號:
- PEB 2466 H V2.2
- 描述:
- IC SICOFI-4 SGL CHIP CMOS MQFP64
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15710 Pieces
簡單介紹
BYCHIPS是 PEB 2466 H V2.2的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的PEB 2466 H V2.2購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 5V |
|---|---|
| 供應商設備封裝: | P-64-MQFP |
| 系列: | SICOFI® |
| 功率（瓦特）: | 130mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 64-QFP |
| 其他名稱: | PEB2466HV2.2XT PEB2466HV22NP PEB2466HV22XP SP000007516 SP000007517 |
| 工作溫度: | 0°C ~ 70°C |
| 電路數: | 4 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商零件編號: | PEB 2466 H V2.2 |
| 接口: | PCM, SPI |
| 包括: | Advanced On-Chip Functions, Digital Signal Processing (DSP) Technique, Level Metering, Tone Generators |
| 功能: | CODEC Filter |
| 展開說明: | Telecom IC CODEC Filter P-64-MQFP |
| 描述: | IC SICOFI-4 SGL CHIP CMOS MQFP64 |
| 供電: | 26mA |
| Email: | [email protected] |
PEB 2466 H V2.2的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers