繁体版
English
Deutsch
Français
русский
español
Português
日本語
Italia
한국의
العربية
Türk dili
polski
Suomi
Indonesia
Tiếng Việt
ภาษาไทย
Nederland
Pilipino
Čeština
繁体中文
Magyarország
Kongeriket
Dansk
Svenska
✕
關於我們
|
聯繫我們
|
在線詢價
|
首 頁
關於Bychips
產品展示
製造商
要求報價
新聞媒體
聯繫Bychips
首 頁
>
產品展示
>
電容器
>
鋁電容器
>
MLSG332M030JK0C
MLSG332M030JK0C
型號:
MLSG332M030JK0C
製造商:
Cornell Dubilier Electronics
描述:
3300UF 30V 5000HR SLIMPACK
無鉛狀態/ RoHS狀態:
包含鉛/ RoHS不兼容
庫存數量:
16777 Pieces
數據表:
MLSG332M030JK0C.pdf
在線詢價
簡單介紹
BYCHIPS是
MLSG332M030JK0C的现货代理商,我們有庫存立即運輸,也可供長時間供應。請寄給我們您的
MLSG332M030JK0C
購買計劃
通過電子郵件,我們會根據您的計劃給您最優惠的價格。
購買
MLSG332M030JK0C與BYCHPS
購買即有保證
產品特性
系列:
*
濕度敏感度(MSL):
1 (Unlimited)
製造商標準交貨期:
17 Weeks
製造商零件編號:
MLSG332M030JK0C
展開說明:
Aluminum Capacitors
描述:
3300UF 30V 5000HR SLIMPACK
Email:
[email protected]
快速詢價
型號
數量
公司
邮箱
電話
要求
MLSG332M030JK0C
的相似型號
圖片
型號
製造商
描述
查看
25SGV33M6.3X6.1
Rubycon
CAP ALUM 33UF 20% 25V SMD
在線詢價
MLSG342M040JA0C
Cornell Dubilier Electronics (CDE)
3400UF 40V 5000HR SLIMPACK
在線詢價
MLSG342M050JH0C
Cornell Dubilier Electronics (CDE)
3400UF 50V 5000HR SLIMPACK
在線詢價
MLSG301M250JH0C
Cornell Dubilier Electronics (CDE)
300UF 250V 5000HR SLIMPACK
在線詢價
MLSG332M060EB0C
Cornell Dubilier Electronics (CDE)
3300UF 60V 5000HR FLATPACK
在線詢價
EMLA250ADA471MJA0G
United Chemi-Con
CAP ALUM 470UF 20% 25V SMD
在線詢價
MLSG301M150JA0C
Cornell Dubilier Electronics (CDE)
300UF 150V 5000HR SLIMPACK
在線詢價
B43505E2687M87
EPCOS (TDK)
CAP ALUM 680UF 20% 200V SNAP
在線詢價
MLSG381M250JB0C
Cornell Dubilier Electronics (CDE)
380UF 250V 5000HR SLIMPACK
在線詢價
35YXG150MEFC8X11.5
Rubycon
CAP ALUM 150UF 20% 35V RADIAL
在線詢價
TVX1A101MAD
Nichicon
CAP ALUM 100UF 20% 10V AXIAL
在線詢價
LGU1J272MELZ
Nichicon
CAP ALUM 2700UF 20% 63V SNAP
在線詢價
MLSG381M200JH0C
Cornell Dubilier Electronics (CDE)
380UF 200V 5000HR SLIMPACK
在線詢價
UPB2C561MRD
Nichicon
CAP ALUM 560UF 20% 160V RADIAL
在線詢價
200BXA68MEFC12.5X25
Rubycon
CAP ALUM 68UF 20% 200V RADIAL
在線詢價
MLSG361M150EK1A
Cornell Dubilier Electronics (CDE)
360UF 150V 5000HR FLATPACK
在線詢價
SLP681M100A1P3
Cornell Dubilier Electronics (CDE)
CAP ALUM 680UF 20% 100V SNAP
在線詢價
最新資訊
Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
Janet Clark to join TI board of directors
TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
GCHQ Director calls for international cyber pact
Embedded World: Arm introduces fourth security element to PSA
Last chance: Nominate BrightSparks before 28 February
Embedded World 2019: Get the full Electronics Weekly Guide
"Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers