購買 GPA040A120L-ND與BYCHPS
購買即有保證
GPA040A120L-ND
- 型號:
- GPA040A120L-ND
- 描述:
- IGBT 1200V 80A 455W TO264
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12295 Pieces
簡單介紹
BYCHIPS是 GPA040A120L-ND的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的GPA040A120L-ND購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 1200V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.8V @ 15V, 40A |
| 測試條件: | 600V, 40A, 5 Ohm, 15V |
| Td（開/關）@ 25°C: | 41ns/200ns |
| 開關能量: | 5.8mJ (on), 1.5mJ (off) |
| 供應商設備封裝: | TO-264 |
| 系列: | - |
| 反向恢復時間（trr）: | 220ns |
| 功率 - 最大: | 455W |
| 封装: | Tube |
| 封裝/箱體: | TO-264-3, TO-264AA |
| 其他名稱: | 1560-1223-1 1560-1223-1-ND |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | GPA040A120L-ND |
| 輸入類型: | Standard |
| IGBT類型: | NPT and Trench |
| 柵極電荷: | 510nC |
| 展開說明: | IGBT NPT and Trench 1200V 80A 455W Through Hole TO-264 |
| 描述: | IGBT 1200V 80A 455W TO264 |
| 電流 - 集電極脈衝（ICM）: | 120A |
| 電流 - 集電極（Ic）（最大）: | 80A |
| Email: | [email protected] |
GPA040A120L-ND的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
IRGP4063DPBF | Infineon Technologies | IGBT 600V 96A 330W TO247AC | 在線詢價 |
 |
GPA040A120MN-FD | Global Power Technologies Group | IGBT 1200V 80A 480W TO3PN | 在線詢價 |
 |
GPA042A100L-ND | Global Power Technologies Group | IGBT 1000V 60A 463W TO264 | 在線詢價 |
 |
STGW25H120DF2 | STMicroelectronics | IGBT H-SERIES 1200V 25A TO-247 | 在線詢價 |
|
GPA040A120L-FD | Global Power Technologies Group | IGBT 1200V 80A 480W TO264 | 在線詢價 |
|
IRG4PC40FDPBF | Infineon Technologies | IGBT 600V 49A 160W TO247AC | 在線詢價 |
 |
IXGT32N60C | IXYS | IGBT 600V 60A 200W TO268 | 在線詢價 |
 |
IXGH30N120BD1 | IXYS | IGBT 1200V 50A TO247 | 在線詢價 |
|
IRGP4740DPBF | Infineon Technologies | IGBT 650V TO-247 | 在線詢價 |
 |
IGP50N60TXKSA1 | Infineon Technologies | IGBT 600V 100A 333W TO220-3 | 在線詢價 |
|
IRG4PC40KDPBF | Infineon Technologies | IGBT 600V 42A 160W TO247AC | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers