購買 ZXTC2045E6QTA與BYCHPS
購買即有保證
ZXTC2045E6QTA
- 型號:
- ZXTC2045E6QTA
- 描述:
- TRANS NPN/PNP 30V 1.5A
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15674 Pieces
簡單介紹
BYCHIPS是 ZXTC2045E6QTA的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ZXTC2045E6QTA購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 30V |
|---|---|
| Vce飽和（最大）@ IB，IC: | 375mV @ 15mA, 750mA |
| 晶體管類型: | NPN, PNP |
| 供應商設備封裝: | SOT-26 |
| 系列: | - |
| 功率 - 最大: | 700mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | SOT-23-6 |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | ZXTC2045E6QTA |
| 頻率 - 轉換: | 265MHz, 195MHz |
| 展開說明: | Bipolar (BJT) Transistor Array NPN, PNP 30V 1.5A 265MHz, 195MHz 700mW Surface Mount SOT-26 |
| 描述: | TRANS NPN/PNP 30V 1.5A |
| 直流電流增益（HFE）（最小值）@ IC，的Vce: | 180 @ 100mA, 2V |
| 電流 - 集電極截止（最大）: | 20nA (ICBO) |
| 電流 - 集電極（Ic）（最大）: | 1.5A |
| Email: | [email protected] |
ZXTC2045E6QTA的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SMA4020 | Sanken | TRANS 4PNP DARL 60V 4A 12SIP | 在線詢價 |
 |
BCM857BV,315 | Nexperia USA Inc. | TRANS 2PNP 45V 0.1A SOT-666 | 在線詢價 |
 |
ZXTC2063E6TA | Diodes Incorporated | TRANS NPN/PNP 40V 3.5A/3A SOT23 | 在線詢價 |
|
ZXTC2045E6TA | Diodes Incorporated | TRANS NPN/PNP 30V 1.5A SOT23-6 | 在線詢價 |
 |
XN0155800L | Panasonic Electronic Components | TRANS 2NPN 20V 0.5A MINI5 | 在線詢價 |
 |
ZDT690TC | Diodes Incorporated | TRANS 2NPN 45V 2A SM8 | 在線詢價 |
|
ZXTC2062E6TA | Diodes Incorporated | TRANS NPN/PNP 20V 4A/3.5A SOT23 | 在線詢價 |
 |
BCM857BS/ZLF | Nexperia USA Inc. | TRANS 2NPN 45V 0.1A 6TSSOP | 在線詢價 |
 |
MMDT4413-7 | Diodes Incorporated | TRANS NPN/PNP 40V 0.6A SOT363 | 在線詢價 |
|
ZXTC2061E6TA | Diodes Incorporated | TRANS NPN/PNP 12V 5A/3.5A SOT23 | 在線詢價 |
 |
JANTXV2N3811U | Microsemi Corporation | TRANS 2PNP 60V 0.05A | 在線詢價 |
|
MBT3946DW1T2G | ON Semiconductor | TRANS NPN/PNP 40V 0.2A SOT363 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers