購買 ZVP2120GTC與BYCHPS
購買即有保證
ZVP2120GTC
- 型號:
- ZVP2120GTC
- 描述:
- MOSFET P-CH 200V 0.2A SOT223
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13836 Pieces
- 數據表:
- ZVP2120GTC.pdf
簡單介紹
BYCHIPS是 ZVP2120GTC的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的ZVP2120GTC購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 3.5V @ 1mA |
|---|---|
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | SOT-223 |
| 系列: | - |
| RDS（ON）（最大值）@標識，柵極電壓: | 25 Ohm @ 150mA, 10V |
| 功率耗散（最大）: | 2W (Ta) |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-261-4, TO-261AA |
| 工作溫度: | -55°C ~ 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | ZVP2120GTC |
| 輸入電容（Ciss）（Max）@ Vds: | 100pF @ 25V |
| 柵極電荷（Qg）（Max）@ Vgs: | - |
| FET型: | P-Channel |
| FET特點: | - |
| 展開說明: | P-Channel 200V 200mA (Ta) 2W (Ta) Surface Mount SOT-223 |
| 漏極至源極電壓（Vdss）: | 200V |
| 描述: | MOSFET P-CH 200V 0.2A SOT223 |
| 電流 - 25°C連續排水（Id）: | 200mA (Ta) |
| Email: | [email protected] |
ZVP2120GTC的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
ZVP2120ASTZ | Diodes Incorporated | MOSFET P-CH 200V 0.12A TO92-3 | 在線詢價 |
 |
ZVP2120A | Diodes Incorporated | MOSFET P-CH 200V 0.12A TO92-3 | 在線詢價 |
 |
ZVP2120ASTOA | Diodes Incorporated | MOSFET P-CH 200V 0.12A TO92-3 | 在線詢價 |
|
ZVP2110ASTZ | Diodes Incorporated | MOSFET P-CH 100V 0.23A TO92-3 | 在線詢價 |
|
ZVP2106AS | Diodes Incorporated | MOSFET P-CH 60V 0.28A TO92-3 | 在線詢價 |
|
ZVP2120ASTOB | Diodes Incorporated | MOSFET P-CH 200V 0.12A TO92-3 | 在線詢價 |
 |
ZVP2120GTA | Diodes Incorporated | MOSFET P-CH 200V 0.2A SOT223 | 在線詢價 |
|
ZVP2110GTC | Diodes Incorporated | MOSFET P-CH 100V 0.31A SOT223 | 在線詢價 |
|
ZVP2106GTC | Diodes Incorporated | MOSFET P-CH 60V 0.45A SOT223 | 在線詢價 |
|
ZVP2110GTA | Diodes Incorporated | MOSFET P-CH 100V 0.31A SOT223 | 在線詢價 |
|
ZVP2110ASTOB | Diodes Incorporated | MOSFET P-CH 100V 0.23A TO92-3 | 在線詢價 |
|
ZVP2106ASTOB | Diodes Incorporated | MOSFET P-CH 60V 0.28A TO92-3 | 在線詢價 |
|
ZVP2106GTA | Diodes Incorporated | MOSFET P-CH 60V 450MA SOT223 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers