購買 WF135250WL50236BJ1與BYCHPS
購買即有保證
WF135250WL50236BJ1
- 型號:
- WF135250WL50236BJ1
- 描述:
- CAP CER 5000PF 16KV SCREW
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 14054 Pieces
簡單介紹
BYCHIPS是 WF135250WL50236BJ1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的WF135250WL50236BJ1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 16000V (16kV) |
|---|---|
| 公差: | ±10% |
| 厚度（最大）: | - |
| 溫度係數: | - |
| 尺寸/尺寸: | 5.315" Dia (135.00mm) |
| 系列: | TWXF |
| 評級: | - |
| 封装: | Bulk |
| 封裝/箱體: | Nonstandard, Screw Terminals |
| 工作溫度: | - |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | WF135250WL50236BJ1 |
| 引線型: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | 9.843" (250.00mm) |
| 特徵: | - |
| 展開說明: | 5000pF ±10% 16000V (16kV) Ceramic Capacitor Nonstandard, Screw Terminals |
| 描述: | CAP CER 5000PF 16KV SCREW |
| 電容: | 5000pF |
| 應用: | General Purpose |
| Email: | [email protected] |
WF135250WL50236BJ1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
WF135250WL50238BJ1 | Vishay Beyschlag | CAP CER 5000PF 16KV SCREW | 在線詢價 |
|
WF135242BQ25238BJ1 | Vishay Beyschlag | CAP CER 2500PF 25KV SCREW | 在線詢價 |
|
WF135242BQ25236BJ1 | Vishay Beyschlag | CAP CER 2500PF 25KV SCREW | 在線詢價 |
|
WF135272WL60236BJ1 | Vishay Beyschlag | CAP CER 6000PF 16KV SCREW | 在線詢價 |
|
WF135272WL60238BJ2 | Vishay Beyschlag | CAP CER 6000PF 16KV SCREW | 在線詢價 |
|
WF135272WL60238BJ1 | Vishay Beyschlag | CAP CER 6000PF 16KV SCREW | 在線詢價 |
|
WF135373BQ50238BJ1 | Vishay Beyschlag | CAP CER 5000PF 25KV SCREW | 在線詢價 |
|
WF135285WP50233BJ2 | Vishay Beyschlag | CAP CER 5000PF 20KV SCREW | 在線詢價 |
|
WF135265BH88236BJ1 | Vishay Beyschlag | CAP CER 8800PF 10KV SCREW | 在線詢價 |
|
WF135242WP30238BJ1 | Vishay Beyschlag | CAP CER 3000PF 20KV SCREW | 在線詢價 |
|
WF135285WP50236BJ1 | Vishay Beyschlag | CAP CER 5000PF 20KV SCREW | 在線詢價 |
|
WF135218WL40238BJ1 | Vishay Beyschlag | CAP CER 4000PF 16KV SCREW | 在線詢價 |
|
WF135285WP50238BJ1 | Vishay Beyschlag | CAP CER 5000PF 20KV SCREW | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers