購買 VSKE270-04與BYCHPS
購買即有保證
VSKE270-04
- 型號:
- VSKE270-04
- 描述:
- DIODE MODULE 400V 270A MAGNAPAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19470 Pieces
- 數據表:
- VSKE270-04.pdf
簡單介紹
BYCHIPS是 VSKE270-04的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的VSKE270-04購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 正向（Vf）（最大）: | - |
|---|---|
| 電壓 - （Vr）（最大）: | 400V |
| 供應商設備封裝: | MAGN-A-PAK® |
| 速度: | Standard Recovery >500ns, > 200mA (Io) |
| 系列: | - |
| 封装: | Bulk |
| 封裝/箱體: | 3-MAGN-A-PAK™ |
| 其他名稱: | *IRKE270-04 IRKE270-04 IRKE270-04-ND Q1450754 Q696627 |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | VSKE270-04 |
| 展開說明: | Diode Standard 400V 270A Chassis Mount MAGN-A-PAK® |
| 二極管類型: | Standard |
| 描述: | DIODE MODULE 400V 270A MAGNAPAK |
| 電流 - Vr時反向漏電: | 50mA @ 400V |
| 電流 - 平均整流（Io）: | 270A |
| 電容@ Vr，F時: | - |
| Email: | [email protected] |
VSKE270-04的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers