購買 VII50-06P1與BYCHPS
購買即有保證
VII50-06P1
- 型號:
- VII50-06P1
- 製造商:
- IXYS Corporation
- 描述:
- MOD IGBT PHASE LEG 600V ECOPAC2
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 15028 Pieces
- 數據表:
- VII50-06P1.pdf
簡單介紹
BYCHIPS是 VII50-06P1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的VII50-06P1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 600V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.9V @ 15V, 50A |
| 供應商設備封裝: | ECO-PAC2 |
| 系列: | - |
| 功率 - 最大: | 130W |
| 封裝/箱體: | ECO-PAC2 |
| 工作溫度: | -40°C ~ 150°C (TJ) |
| NTC熱敏電阻: | Yes |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | VII50-06P1 |
| 輸入電容（連鎖商店）@的Vce: | 16nF @ 25V |
| 輸入: | Standard |
| IGBT類型: | NPT |
| 展開說明: | IGBT Module NPT Half Bridge 600V 42.5A 130W Chassis Mount ECO-PAC2 |
| 描述: | MOD IGBT PHASE LEG 600V ECOPAC2 |
| 電流 - 集電極截止（最大）: | 600µA |
| 電流 - 集電極（Ic）（最大）: | 42.5A |
| 組態: | Half Bridge |
| Email: | [email protected] |
VII50-06P1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
APTGF350A60G | Microsemi Corporation | POWER MODULE IGBT 600V 350A SP6 | 在線詢價 |
 |
APT100GT120JRDQ4 | Microsemi Corporation | IGBT 1200V 123A 570W SOT227 | 在線詢價 |
 |
APTGT75DA120D1G | Microsemi Corporation | IGBT 1200V 110A 357W D1 | 在線詢價 |
 |
CPV362M4F | Vishay Semiconductor Diodes Division | IGBT SIP MODULE 600V 8.8A IMS-2 | 在線詢價 |
|
APTGT35X120T3G | Microsemi Corporation | IGBT MOD TRENCH 3PH BRIDGE SP3 | 在線詢價 |
 |
IRG5K50HF06A | Infineon Technologies | MOD IGBT 600V 50A POWIR 34 | 在線詢價 |
 |
FMS6G10US60 | Fairchild/ON Semiconductor | IGBT 600V 10A 25PM-AA | 在線詢價 |
 |
APTGT50H120T3G | Microsemi Corporation | IGBT MOD TRENCH FULL BRIDGE SP3 | 在線詢價 |
 |
VII50-12P1 | IXYS | MOD IGBT PHASE LEG 1200V ECOPAC2 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers