購買 V23079C1106B301與BYCHPS
購買即有保證
V23079C1106B301
- 型號:
- V23079C1106B301
- 描述:
- RELAY GENERAL PURPOSE DPDT 2A 9V
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12026 Pieces
簡單介紹
BYCHIPS是 V23079C1106B301的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的V23079C1106B301購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 開啟電壓（最大值）: | 6.75 VDC |
|---|---|
| 關閉電壓（最小）: | - |
| 端接類型: | PC Pin |
| 切換電壓: | 250VAC, 220VDC - Max |
| 系列: | V23079, AXICOM |
| 發布時間: | 4ms |
| 繼電器類型: | General Purpose |
| 封装: | Tube |
| 其他名稱: | 5-1393788-1 |
| 工作溫度: | -40°C ~ 85°C |
| 操作時間: | 4ms |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | V23079C1106B301 |
| 特徵: | - |
| 展開說明: | General Purpose Relay DPDT (2 Form C) Through Hole |
| 描述: | RELAY GENERAL PURPOSE DPDT 2A 9V |
| 觸點額定值（電流）: | 2A |
| 觸點材料: | Silver Nickel (AgNi), Gold (Au) |
| 聯繫表: | DPDT (2 Form C) |
| 線圈電壓: | 9VDC |
| 線圈類型: | Latching, Single Coil |
| 線圈電阻: | 1.16 kOhms |
| 線圈功率: | 70 mW |
| 線圈電流: | 7.8mA |
| Email: | [email protected] |
V23079C1106B301的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
V23079D2001B301 | TE Connectivity Potter & Brumfield Relays | RELAY GENERAL PURPOSE DPDT 2A 5V | 在線詢價 |
 |
V23079C1111B301 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE DPDT 2A 4.5V | 在線詢價 |
 |
V23079C1105B301 | TE Connectivity Potter & Brumfield Relays | V23079C1105B301 | 在線詢價 |
|
V23079C1102B301 | TE Connectivity Potter & Brumfield Relays | RELAY GENERAL PURPOSE DPDT 2A 6V | 在線詢價 |
|
V23079C1108B301 | TE Connectivity Potter & Brumfield Relays | RELAY GENERAL PURPOSE DPDT 2A 3V | 在線詢價 |
|
V23079C1103B301 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE DPDT 2A 12V | 在線詢價 |
|
V23079C1101B301 | TE Connectivity Potter & Brumfield Relays | RELAY GENERAL PURPOSE DPDT 2A 5V | 在線詢價 |
|
V23079A2016B301 | TE Connectivity Potter & Brumfield Relays | RELAY GENERAL PURPOSE DPDT 2A 4V | 在線詢價 |
|
V23079H1201B301 | TE Connectivity Potter & Brumfield Relays | RELAY GENERAL PURPOSE DPDT 2A 5V | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers