購買 UKA1E331MPD1TD與BYCHPS
購買即有保證
UKA1E331MPD1TD
- 型號:
- UKA1E331MPD1TD
- 製造商:
- Nichicon
- 描述:
- CAP ALUM 330UF 20% 25V RADIAL
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18026 Pieces
簡單介紹
BYCHIPS是 UKA1E331MPD1TD的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的UKA1E331MPD1TD購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓: | 25V |
|---|---|
| 公差: | ±20% |
| 表面貼裝佔地面積: | - |
| 尺寸/尺寸: | 0.315" Dia (8.00mm) |
| 系列: | UKA |
| 紋波電流: | 290mA @ 120Hz |
| 極化: | Polar |
| 封装: | Cut Tape (CT) |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | 493-4652-1 |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 17 Weeks |
| 製造商零件編號: | UKA1E331MPD1TD |
| 壽命@溫度。: | 2000 Hrs @ 105°C |
| 引線間距: | 0.138" (3.50mm) |
| 阻抗: | - |
| 高度 - 座高（最大）: | 0.512" (13.00mm) |
| 展開說明: | 330µF 25V Aluminum Capacitors Radial, Can 2000 Hrs @ 105°C |
| ESR（等效串聯電阻）: | - |
| 描述: | CAP ALUM 330UF 20% 25V RADIAL |
| 電容: | 330µF |
| 應用: | Audio |
| Email: | [email protected] |
UKA1E331MPD1TD的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
UKA1E471MPD | Nichicon | CAP ALUM 470UF 20% 25V RADIAL | 在線詢價 |
 |
UKA1E332MHD | Nichicon | CAP ALUM 3300UF 20% 25V RADIAL | 在線詢價 |
 |
UKA1E331MPD | Nichicon | CAP ALUM 330UF 20% 25V RADIAL | 在線詢價 |
 |
UKA1E330MDD | Nichicon | CAP ALUM 33UF 20% 25V RADIAL | 在線詢價 |
|
UKA1E330MDD1TD | Nichicon | CAP ALUM 33UF 20% 25V RADIAL | 在線詢價 |
 |
UKA1E472MHD | Nichicon | CAP ALUM 4700UF 20% 25V RADIAL | 在線詢價 |
|
UKA1E470MDD1TD | Nichicon | CAP ALUM 47UF 20% 25V RADIAL | 在線詢價 |
 |
UKA1E101MED | Nichicon | CAP ALUM 100UF 20% 25V RADIAL | 在線詢價 |
 |
UKA1E102MPD | Nichicon | CAP ALUM 1000UF 20% 25V RADIAL | 在線詢價 |
 |
UKA1E682MHD | Nichicon | CAP ALUM 6800UF 20% 25V RADIAL | 在線詢價 |
|
UKA1E102MPD1TD | Nichicon | CAP ALUM 1000UF 20% 25V RADIAL | 在線詢價 |
|
UKA1E101MED1TD | Nichicon | CAP ALUM 100UF 20% 25V RADIAL | 在線詢價 |
|
UKA1E220MDD | Nichicon | CAP ALUM 22UF 20% 25V RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers