購買 UCC2626PW與BYCHPS
購買即有保證
UCC2626PW
- 型號:
- UCC2626PW
- 製造商:
- 描述:
- IC MOTOR CONTROLLER PAR 28TSSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16913 Pieces
- 數據表:
- UCC2626PW.pdf
簡單介紹
BYCHIPS是 UCC2626PW的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的UCC2626PW購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 11 V ~ 14.5 V |
|---|---|
| 電壓 - 負載: | - |
| 技術: | - |
| 供應商設備封裝: | 28-TSSOP |
| 步驟分辨率: | - |
| 系列: | - |
| 封装: | Tube |
| 封裝/箱體: | 28-TSSOP (0.173", 4.40mm Width) |
| 輸出配置: | Pre-Driver - Half Bridge (3) |
| 其他名稱: | 296-34748-5 UCC2626PW-ND |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 安裝類型: | Surface Mount |
| 電機類型 - 步進: | - |
| 電機類型 - 交直流: | Brushless DC (BLDC) |
| 濕度敏感度（MSL）: | 2 (1 Year) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | UCC2626PW |
| 接口: | PWM |
| 功能: | Controller - Commutation, Direction Management |
| 展開說明: | Motor Driver PWM 28-TSSOP |
| 描述: | IC MOTOR CONTROLLER PAR 28TSSOP |
| 電流 - 輸出: | - |
| 應用: | General Purpose |
| Email: | [email protected] |
UCC2626PW的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
UDQ2916LBTR | Allegro MicroSystems, LLC | IC MOTOR DRIVER PAR 24SOIC | 在線詢價 |
|
UCC2626DWG4 | Texas Instruments | IC MOTOR CONTROLLER PAR 28SOIC | 在線詢價 |
|
UCC2626DW | Texas Instruments | IC MOTOR CONTROLLER PAR 28SOIC | 在線詢價 |
|
UCC2626PWG4 | Texas Instruments | IC MOTOR CONTROLLER PAR 28TSSOP | 在線詢價 |
|
DRV2604YZFT | Texas Instruments | IC ERM/LRA HAPTIC DRIVER 9DSBGA | 在線詢價 |
 |
LB1830MC-AH | ON Semiconductor | IC MOTOR DRIVER PAR 10SOIC | 在線詢價 |
 |
A4954ELPTR-T | Allegro MicroSystems, LLC | IC MOTOR DRIVER PAR 16TSSOP | 在線詢價 |
|
LB1948MC-ZH | ON Semiconductor | IC MOTOR DRIVER PAR 10MFPSK | 在線詢價 |
 |
LB1945D-E | ON Semiconductor | IC MOTOR DRIVER PAR 30DIP | 在線詢價 |
 |
A3932SEQ | Allegro MicroSystems, LLC | IC MOTOR CONTROLLER PAR 32PLCC | 在線詢價 |
|
LB11861MC-AH | ON Semiconductor | IC MOTOR DRIVER PWM 10MFPSK | 在線詢價 |
 |
TLE7184FXUMA1 | Infineon Technologies | IC MOTOR CONTROLLER PAR 48VQFN | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers