購買 TV1030-3R0106-R與BYCHPS
購買即有保證
TV1030-3R0106-R
- 型號:
- TV1030-3R0106-R
- 製造商:
- Bussmann (Eaton)
- 描述:
- CAP, 3.0V, 10F
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18298 Pieces
簡單介紹
BYCHIPS是 TV1030-3R0106-R的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的TV1030-3R0106-R購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 3V |
|---|---|
| 公差: | -10%, +30% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 0.413" Dia (10.50mm) |
| 系列: | TV |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | 283-4668 |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | TV1030-3R0106-R |
| 壽命@溫度。: | 1000 Hrs @ 85°C |
| 引線間距: | 0.197" (5.00mm) |
| 高度 - 座高（最大）: | 1.240" (31.50mm) |
| 展開說明: | 10F -10%, +30%(EDLC) Supercapacitor 3V Radial, Can 26 mOhm 1000 Hrs @ 85°C |
| ESR（等效串聯電阻）: | 26 mOhm |
| 描述: | CAP, 3.0V, 10F |
| 電容: | 10F |
| Email: | [email protected] |
TV1030-3R0106-R的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
PAS1840LA3R0506 | Taiyo Yuden | CAP 50F 20% 3V THROUGH HOLE | 在線詢價 |
 |
JJD0E408MSEGBB | Nichicon | CAP 4000F 20% 2.5V CHASSIS MOUNT | 在線詢價 |
 |
BZ01CA223ZSB | AVX Corporation | CAP 22MF -20% +80% 12V SMD | 在線詢價 |
 |
JJL0E158MSEFBN | Nichicon | CAP 1500F 2.5V 20% CHASSIS MOUNT | 在線詢價 |
 |
DMT334R2S474M3DTA0 | Murata Electronics North America | CAP SUPER 470MF 4.2V 3-SMD | 在線詢價 |
 |
MAL219612334E3 | Vishay BC Components | CAP 330MF -20%, +80% 5.5V T/H | 在線詢價 |
 |
EEC-S5R5H474 | Panasonic Electronic Components | CAP 470MF -20% +150% 5.5V T/H | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers