購買 THJD685M035RJN與BYCHPS
購買即有保證
THJD685M035RJN
- 型號:
- THJD685M035RJN
- 製造商:
- AVX Corporation
- 描述:
- CAP TANT 6.8UF 35V 20% 2917
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17112 Pieces
簡單介紹
BYCHIPS是 THJD685M035RJN的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的THJD685M035RJN購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 35V |
|---|---|
| 類型: | Molded |
| 公差: | ±20% |
| 尺寸/尺寸: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| 系列: | THJ |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 2917 (7343 Metric) |
| 工作溫度: | -55°C ~ 175°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商尺寸代碼: | D |
| 製造商零件編號: | THJD685M035RJN |
| 壽命@溫度。: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | 0.122" (3.10mm) |
| 特徵: | General Purpose |
| 失敗率: | - |
| 展開說明: | 6.8µF ±20% Molded Tantalum Capacitors 35V 2917 (7343 Metric) 1.3 Ohm |
| ESR（等效串聯電阻）: | 1.3 Ohm |
| 描述: | CAP TANT 6.8UF 35V 20% 2917 |
| 電容: | 6.8µF |
| Email: | [email protected] |
THJD685M035RJN的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
TPSC156K016T0300 | AVX Corporation | CAP TANT 2312 | 在線詢價 |
 |
THJD685K035RJN | AVX Corporation | CAP TANT 6.8UF 35V 10% 2917 | 在線詢價 |
|
THJD686M016RJN | AVX Corporation | CAP TANT 68UF 16V 20% 2917 | 在線詢價 |
 |
T86C105M050EBAL | Vishay Sprague | CAP TANT 1UF 50V 20% 2312 | 在線詢價 |
|
THJD685K050RJN | AVX Corporation | CAP TANT 6.8UF 50V 10% 2917 | 在線詢價 |
|
M39006/09-8467 | Vishay Sprague | CAP TANT 15UF 5% 15V AXIAL | 在線詢價 |
|
THJD686K016RJN | AVX Corporation | CAP TANT 68UF 16V 10% 2917 | 在線詢價 |
 |
TPME106K050S0120 | AVX Corporation | CAP TANT 10UF 50V 10% 2917 | 在線詢價 |
 |
TPSB226K010Y0700 | AVX Corporation | CAP TANT 22UF 10V 10% 1411 | 在線詢價 |
|
M39003/01-6260 | Vishay Sprague | CAP TANT 0.56UF 10% 75V AXIAL | 在線詢價 |
|
M39003/03-0274 | Vishay Sprague | CAP TANT 68UF 10% 35V AXIAL | 在線詢價 |
|
M39003/01-5712/HSD | Vishay Sprague | CAP TANT 2.7UF 5% 75V AXIAL | 在線詢價 |
|
T95Y685K025LZSL | Vishay Sprague | CAP TANT 6.8UF 25V 10% 2910 | 在線詢價 |
|
M39003/01-8359/HSD | Vishay Sprague | CAP TANT 0.33UF 5% 100V AXIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers