購買 TH3A105M020D5900與BYCHPS
購買即有保證
TH3A105M020D5900
- 型號:
- TH3A105M020D5900
- 製造商:
- Vishay / Sprague
- 描述:
- CAP TANT 1UF 20V 20% 1206
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12358 Pieces
簡單介紹
BYCHIPS是 TH3A105M020D5900的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的TH3A105M020D5900購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 20V |
|---|---|
| 類型: | Molded |
| 公差: | ±20% |
| 尺寸/尺寸: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| 系列: | TANTAMOUNT®, TH3 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1206 (3216 Metric) |
| 工作溫度: | -55°C ~ 150°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 18 Weeks |
| 製造商尺寸代碼: | A |
| 製造商零件編號: | TH3A105M020D5900 |
| 壽命@溫度。: | - |
| 引線間距: | - |
| 高度 - 座高（最大）: | 0.071" (1.80mm) |
| 特徵: | General Purpose |
| 失敗率: | - |
| 展開說明: | 1µF ±20% Molded Tantalum Capacitors 20V 1206 (3216 Metric) 5.9 Ohm |
| ESR（等效串聯電阻）: | 5.9 Ohm |
| 描述: | CAP TANT 1UF 20V 20% 1206 |
| 電容: | 1µF |
| Email: | [email protected] |
TH3A105M020D5900的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
TH3A105M020F5900 | Vishay Sprague | CAP TANT 1UF 20V 20% 1206 | 在線詢價 |
|
TH3A105M016F6500 | Vishay Sprague | CAP TANT 1UF 16V 20% 1206 | 在線詢價 |
|
TH3A105M025C3000 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
|
TH3A105M020E5900 | Vishay Sprague | CAP TANT 1UF 20V 20% 1206 | 在線詢價 |
|
TH3A105M025F5200 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
|
TH3A105M035F6600 | Vishay Sprague | CAP TANT 1UF 35V 20% 1206 | 在線詢價 |
|
TH3A105M025E5200 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
|
TH3A105M020C5900 | Vishay Sprague | CAP TANT 1UF 20V 20% 1206 | 在線詢價 |
|
TH3A105M025F3000 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
|
TH3A105M025D3000 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
|
TH3A105M025D5200 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
|
TH3A105M025E3000 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
|
TH3A105M025C5200 | Vishay Sprague | CAP TANT 1UF 25V 20% 1206 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers