購買 TC74HC126AP(F)與BYCHPS
購買即有保證
TC74HC126AP(F)
- 型號:
- TC74HC126AP(F)
- 描述:
- IC BUFFER NON-INVERT 6V 14DIP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18186 Pieces
簡單介紹
BYCHIPS是 TC74HC126AP(F)的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的TC74HC126AP(F)購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 2 V ~ 6 V |
|---|---|
| 供應商設備封裝: | 14-DIP |
| 系列: | TC74HC |
| 封装: | Cut Tape (CT) |
| 封裝/箱體: | 14-DIP (0.300", 7.62mm) |
| 輸出類型: | Push-Pull |
| 其他名稱: | TC74HC126AP(F)CT TC74HC126AP(F)CT-ND |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 元素的數量: | 4 |
| 每個元件的位元數: | 1 |
| 安裝類型: | Through Hole |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | TC74HC126AP(F) |
| 邏輯類型: | Buffer, Non-Inverting |
| 輸入類型: | - |
| 展開說明: | Buffer, Non-Inverting Element 1 Bit per Element Push-Pull Output 14-DIP |
| 描述: | IC BUFFER NON-INVERT 6V 14DIP |
| 電流 - 輸出高，低: | 7.8mA, 7.8mA |
| Email: | [email protected] |
TC74HC126AP(F)的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers