購買 T55A686M2R5C0200與BYCHPS
購買即有保證
T55A686M2R5C0200
- 型號:
- T55A686M2R5C0200
- 製造商:
- Vishay / Sprague
- 描述:
- CAP TANT POLY 68UF 2.5V 1206
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18474 Pieces
簡單介紹
BYCHIPS是 T55A686M2R5C0200的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的T55A686M2R5C0200購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 2.5V |
|---|---|
| 類型: | Molded |
| 公差: | ±20% |
| 尺寸/尺寸: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| 系列: | vPolyTan™ T55 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1206 (3216 Metric) |
| 其他名稱: | 718-2155-2 |
| 工作溫度: | -55°C ~ 105°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 13 Weeks |
| 製造商尺寸代碼: | A |
| 製造商零件編號: | T55A686M2R5C0200 |
| 壽命@溫度。: | 1000 Hrs @ 105°C |
| 引線間距: | - |
| 高度 - 座高（最大）: | 0.071" (1.80mm) |
| 特徵: | General Purpose |
| 展開說明: | 68µF ±20% Molded Tantalum Polymer Capacitor 2.5V 1206 (3216 Metric) 200 mOhm @ 100kHz |
| ESR（等效串聯電阻）: | 200 mOhm @ 100kHz |
| 描述: | CAP TANT POLY 68UF 2.5V 1206 |
| 電容: | 68µF |
| Email: | [email protected] |
T55A686M2R5C0200的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
M551B418M006AH | KEMET | CAP TANT POLY 4100UF 6V CHA MNT | 在線詢價 |
|
M550B377M075AH | KEMET | CAP TANT POLY 370UF 75V CHA MNT | 在線詢價 |
 |
T55A226M010C0500 | Vishay Sprague | CAP TANT POLY 22UF 10V 1206 | 在線詢價 |
|
T55A686M004C0200 | Vishay Sprague | CAP TANT POLY 68UF 4V 1206 | 在線詢價 |
|
T55A685M010C0200 | Vishay Sprague | CAP TANT POLY 6.8UF 10V 1206 | 在線詢價 |
 |
T540D687K2R5DH85057610 | KEMET | CAP TANT POLY 680UF 2.5V 2917 | 在線詢價 |
|
T55A685M6R3C0500 | Vishay Sprague | CAP TANT POLY 6.8UF 6.3V 1206 | 在線詢價 |
|
M550B507M040AH | KEMET | CAP TANT POLY 500UF 40V CHA MNT | 在線詢價 |
|
T55A686M004C0500 | Vishay Sprague | CAP TANT POLY 68UF 4V 1206 | 在線詢價 |
 |
TCJB337M002R0035 | AVX Corporation | CAP TANT POLY 330UF 2.5V 1210 | 在線詢價 |
|
M551B828K006AS | KEMET | CAP TANT POLY 8200UF 6V CHA MNT | 在線詢價 |
|
T55A685M010C0500 | Vishay Sprague | CAP TANT POLY 6.8UF 10V 1206 | 在線詢價 |
 |
2R5TPE1000MF | Panasonic Electronic Components | CAP TANT POLY 1000UF 2.5V 2917 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers