購買 SRU8045A-3R5Y與BYCHPS
購買即有保證
SRU8045A-3R5Y
- 型號:
- SRU8045A-3R5Y
- 製造商:
- Bourns, Inc.
- 描述:
- FIXED IND 3.5UH 5A 25 MOHM SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17391 Pieces
簡單介紹
BYCHIPS是 SRU8045A-3R5Y的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SRU8045A-3R5Y購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±30% |
| 尺寸/尺寸: | 0.315" L x 0.315" W (8.00mm x 8.00mm) |
| 屏蔽: | Shielded |
| 系列: | SRU8045A |
| 評級: | AEC-Q200 |
| Q因子@頻率: | 12 @ 7.96MHz |
| 封装: | Original-Reel® |
| 封裝/箱體: | 4-SMD |
| 其他名稱: | SRU8045A-3R5YDKR |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Ferrite |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | SRU8045A-3R5Y |
| 電感: | 3.5µH |
| 高度 - 座高（最大）: | 0.189" (4.80mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | 45MHz |
| 展開說明: | 3.5µH Shielded Wirewound Inductor 5A 25 mOhm Max 4-SMD |
| 描述: | FIXED IND 3.5UH 5A 25 MOHM SMD |
| 直流電阻（DCR）: | 25 mOhm Max |
| 目前評級: | 5A |
| 電流 - 飽和: | 5A |
| Email: | [email protected] |
SRU8045A-3R5Y的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SRU8045A-470Y | Bourns Inc. | FIXED IND 47UH 1.45A 270 MOHM | 在線詢價 |
|
SRU8045A-220Y | Bourns Inc. | FIXED IND 22UH 2.25A 122 MOHM | 在線詢價 |
|
SRU8045A-6R2Y | Bourns Inc. | FIXED IND 6.2UH 4.2A 36 MOHM SMD | 在線詢價 |
|
SRU8045A-100Y | Bourns Inc. | FIXED IND 10UH 3.5A 48 MOHM SMD | 在線詢價 |
|
SRU8045A-101Y | Bourns Inc. | FIXED IND 100UH 1A 500 MOHM SMD | 在線詢價 |
|
SRU8045A-4R7Y | Bourns Inc. | FIXED IND 4.7UH 4.6A 27.5 MOHM | 在線詢價 |
 |
SRU8043-2R2Y | Bourns Inc. | FIXED IND 2.2UH 5.4A 11.2 MOHM | 在線詢價 |
|
SRU8043-680Y | Bourns Inc. | FIXED IND 68UH 1.2A 192 MOHM SMD | 在線詢價 |
|
SRU8043-220Y | Bourns Inc. | FIXED IND 22UH 2.2A 72.5 MOHM | 在線詢價 |
|
SRU8045A-680Y | Bourns Inc. | FIXED IND 68UH 1.25A 400 MOHM | 在線詢價 |
|
SRU8045A-330Y | Bourns Inc. | FIXED IND 33UH 2A 150 MOHM SMD | 在線詢價 |
|
SRU8043-330Y | Bourns Inc. | FIXED IND 33UH 1.7A 100 MOHM SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers