購買 SRU2009-1R0Y與BYCHPS
購買即有保證
SRU2009-1R0Y
- 型號:
- SRU2009-1R0Y
- 製造商:
- Bourns, Inc.
- 描述:
- FIXED IND 1UH 1.45A 110 MOHM SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13179 Pieces
- 數據表:
- SRU2009-1R0Y.pdf
簡單介紹
BYCHIPS是 SRU2009-1R0Y的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SRU2009-1R0Y購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±30% |
| 供應商設備封裝: | - |
| 尺寸/尺寸: | 0.110" L x 0.110" W (2.80mm x 2.80mm) |
| 屏蔽: | Shielded |
| 系列: | SRU2009 |
| 評級: | - |
| Q因子@頻率: | 7 @ 7.96MHz |
| 封装: | Original-Reel® |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | SRU2009-1R0YDKR |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Ferrite |
| 製造商標準交貨期: | 20 Weeks |
| 製造商零件編號: | SRU2009-1R0Y |
| 電感: | 1µH |
| 高度 - 座高（最大）: | 0.039" (1.00mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | 200MHz |
| 展開說明: | 1µH Shielded Wirewound Inductor 1.45A 110 mOhm Max Nonstandard |
| 描述: | FIXED IND 1UH 1.45A 110 MOHM SMD |
| 直流電阻（DCR）: | 110 mOhm Max |
| 目前評級: | 1.45A |
| 電流 - 飽和: | 1.3A |
| Email: | [email protected] |
SRU2009-1R0Y的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SRU2016-4R7Y | Bourns Inc. | FIXED IND 4.7UH 1.15A 215 MOHM | 在線詢價 |
 |
SRU2009-6R8Y | Bourns Inc. | FIXED IND 6.8UH 520MA 650 MOHM | 在線詢價 |
|
SRU2009-4R4Y | Bourns Inc. | FIXED IND 4.4UH 680MA 430 MOHM | 在線詢價 |
|
SRU2009-100Y | Bourns Inc. | FIXED IND 10UH 400MA 1.08 OHM | 在線詢價 |
|
SRU2009-220Y | Bourns Inc. | FIXED IND 22UH 220MA 2.6 OHM SMD | 在線詢價 |
|
SRU2016-6R0Y | Bourns Inc. | FIXED IND 6UH 900MA 250 MOHM SMD | 在線詢價 |
|
SRU2009-2R2Y | Bourns Inc. | FIXED IND 2.2UH 1.1A 210 MOHM | 在線詢價 |
 |
SRU2011-1R0Y | Bourns Inc. | FIXED IND 1UH 1.65A 100 MOHM SMD | 在線詢價 |
|
SRU2009-3R3Y | Bourns Inc. | FIXED IND 3.3UH 800MA 320 MOHM | 在線詢價 |
|
SRU2009-150Y | Bourns Inc. | FIXED IND 15UH 300MA 1.37 OHM | 在線詢價 |
 |
SRU2013-100Y | Bourns Inc. | FIXED IND 10UH 670MA 520 MOHM | 在線詢價 |
|
SRU2013-4R7Y | Bourns Inc. | FIXED IND 4.7UH 900MA 220 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers