購買 SRP2512-1R5M與BYCHPS
購買即有保證
SRP2512-1R5M
- 型號:
- SRP2512-1R5M
- 製造商:
- Bourns, Inc.
- 描述:
- FIXED IND 1.5UH 2.5A 77 MOHM SMD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16433 Pieces
- 數據表:
- SRP2512-1R5M.pdf
簡單介紹
BYCHIPS是 SRP2512-1R5M的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SRP2512-1R5M購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±20% |
| 尺寸/尺寸: | 0.098" L x 0.079" W (2.50mm x 2.00mm) |
| 屏蔽: | Shielded |
| 系列: | SRP2512 |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 1008 (2520 Metric) |
| 工作溫度: | -40°C ~ 125°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Powdered Iron |
| 製造商標準交貨期: | 18 Weeks |
| 製造商零件編號: | SRP2512-1R5M |
| 電感: | 1.5µH |
| 高度 - 座高（最大）: | 0.047" (1.20mm) |
| 頻率 - 測試: | 1MHz |
| 頻率 - 自諧振: | - |
| 展開說明: | 1.5µH Shielded Wirewound Inductor 2.5A 77 mOhm Max 1008 (2520 Metric) |
| 描述: | FIXED IND 1.5UH 2.5A 77 MOHM SMD |
| 直流電阻（DCR）: | 77 mOhm Max |
| 目前評級: | 2.5A |
| 電流 - 飽和: | 3.2A |
| Email: | [email protected] |
SRP2512-1R5M的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SRP2512-R68M | Bourns Inc. | FIXED IND 680NH 3.7A 35 MOHM SMD | 在線詢價 |
 |
IHSM5832ER390L | Vishay Dale | FIXED IND 39UH 1.8A 190 MOHM SMD | 在線詢價 |
|
SRP2512-R47M | Bourns Inc. | FIXED IND 470NH 4.5A 25 MOHM SMD | 在線詢價 |
 |
SRU1038-100Y | Bourns Inc. | FIXED IND 10UH 3.8A 25 MOHM SMD | 在線詢價 |
 |
S1210-823J | API Delevan Inc. | FIXED IND 82UH 137MA 8.5 OHM SMD | 在線詢價 |
|
SRP2512-1R0M | Bourns Inc. | FIXED IND 1UH 3.4A 49 MOHM SMD | 在線詢價 |
 |
AISR-875-682K | Abracon LLC | FIXED IND 6.8MH 100MA 21.8 OHM | 在線詢價 |
|
SRP2512-2R2M | Bourns Inc. | FIXED IND 2.2UH 2.1A 104 MOHM | 在線詢價 |
 |
3625B331KT | TE Connectivity Passive Product | FIXED IND 330UH 620MA 950 MOHM | 在線詢價 |
 |
LQM2MPN1R5NG0L | Murata Electronics North America | FIXED IND 1.5UH 1.2A 110 MOHM | 在線詢價 |
 |
NL565050T-222J-PF | TDK Corporation | FIXED IND 2.2MH 55MA 35 OHM SMD | 在線詢價 |
 |
CDEP147NP-6R1MC-125 | Sumida America Components Inc. | FIXED IND 6.1UH 12.5A 6.03 MOHM | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers