購買 SN74SSTU32864CZKER與BYCHPS
購買即有保證
SN74SSTU32864CZKER
- 型號:
- SN74SSTU32864CZKER
- 製造商:
- 描述:
- IC 25BIT CONFIG REG BUFF 96-BGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18252 Pieces
簡單介紹
BYCHIPS是 SN74SSTU32864CZKER的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SN74SSTU32864CZKER購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電源電壓: | 1.7 V ~ 1.9 V |
|---|---|
| 供應商設備封裝: | 96-PBGA MICROSTAR (13.6x5.6) |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 96-LFBGA |
| 其他名稱: | 296-17801-2 |
| 工作溫度: | 0°C ~ 70°C |
| 比特數: | 25, 14 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | SN74SSTU32864CZKER |
| 邏輯類型: | 1:1, 1:2 Configurable Registered Buffer |
| 展開說明: | 1:1, 1:2 Configurable Registered Buffer IC 96-PBGA MICROSTAR (13.6x5.6) |
| 描述: | IC 25BIT CONFIG REG BUFF 96-BGA |
| Email: | [email protected] |
SN74SSTU32864CZKER的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
SN74SSTU32864DGKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96LFBGA | 在線詢價 |
|
SN74SSTU32866GKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96LFBGA | 在線詢價 |
|
SN74SSTU32864DZKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96-BGA | 在線詢價 |
|
SN74SSTU32864CGKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96LFBGA | 在線詢價 |
|
SN74SSTU32866ZKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96-BGA | 在線詢價 |
|
SN74SSTU32864GKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96LFBGA | 在線詢價 |
|
SN74SSTU32864ZKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96-BGA | 在線詢價 |
|
SN74SSTU32864EZKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96-BGA | 在線詢價 |
|
SN74SSTU32866AZKER | Texas Instruments | IC 25BIT CONFIG REG BUFF 96-BGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers