購買 SN74CB3T3383DGVR與BYCHPS
購買即有保證
SN74CB3T3383DGVR
- 型號:
- SN74CB3T3383DGVR
- 製造商:
- 描述:
- IC SW BUS-EXCH 10BIT FET 24TVSOP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13230 Pieces
簡單介紹
BYCHIPS是 SN74CB3T3383DGVR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SN74CB3T3383DGVR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓電源: | Single Supply |
|---|---|
| 電壓 - 電源: | 2.3 V ~ 3.6 V |
| 類型: | Bus FET Exchange Switch |
| 供應商設備封裝: | 24-TVSOP |
| 系列: | 74CB |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 24-TFSOP (0.173", 4.40mm Width) |
| 其他名稱: | 296-19159-2 74CB3T3383DGVRE4 74CB3T3383DGVRE4-ND 74CB3T3383DGVRG4 74CB3T3383DGVRG4-ND |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | SN74CB3T3383DGVR |
| 獨立電路: | 1 |
| 展開說明: | Bus FET Exchange Switch 5 x 2:2 24-TVSOP |
| 描述: | IC SW BUS-EXCH 10BIT FET 24TVSOP |
| 電流 - 輸出高，低: | - |
| 電路: | 5 x 2:2 |
| Email: | [email protected] |
SN74CB3T3383DGVR的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
SN74CB3T3384PWR | Texas Instruments | IC SWITCH BUS 10BIT FET 24-TSSOP | 在線詢價 |
|
SN74CB3T3384DW | Texas Instruments | IC SWITCH BUS-EXCH 10BIT 24-SOIC | 在線詢價 |
|
SN74CB3T3383DWR | Texas Instruments | IC SW BUS-EXCH 10BIT FET 24-SOIC | 在線詢價 |
|
SN74CB3T3384PW | Texas Instruments | IC SWITCH BUS-EXCH 10BIT 24TSSOP | 在線詢價 |
|
SN74CB3T3384DWR | Texas Instruments | IC SWITCH BUS 10BIT FET 24-SOIC | 在線詢價 |
|
SN74CB3T3384DBQR | Texas Instruments | IC FET BUS SWT 3.3V 10BIT 24QSOP | 在線詢價 |
|
SN74CB3T3383PWR | Texas Instruments | IC SW BUS-EXCH 10BIT FET 24TSSOP | 在線詢價 |
|
SN74CB3T3383PWRG4 | Texas Instruments | IC BUS FET EXCH SWIT SGL 24TSSOP | 在線詢價 |
|
SN74CB3T3383PW | Texas Instruments | IC SWITCH BUS-EXCH 10BIT 24TSSOP | 在線詢價 |
|
SN74CB3T3384PWRG4 | Texas Instruments | IC FET BUS SWITCH DUAL 24TSSOP | 在線詢價 |
|
SN74CB3T3383DW | Texas Instruments | IC SWITCH BUS-EXCH 10BIT 24-SOIC | 在線詢價 |
|
SN74CB3T3383DBQR | Texas Instruments | IC SW BUS-EXCH 10BIT FET 24-QSOP | 在線詢價 |
|
SN74CB3T3384PWG4 | Texas Instruments | IC FET BUS SWITCH DUAL 24TSSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers