購買 SN74AVC2T45DCUTG4與BYCHPS
購買即有保證
SN74AVC2T45DCUTG4
- 型號:
- SN74AVC2T45DCUTG4
- 製造商:
- 描述:
- IC BUS TRANSCVR TRI-ST 2B US8
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18107 Pieces
簡單介紹
BYCHIPS是 SN74AVC2T45DCUTG4的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SN74AVC2T45DCUTG4購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - VCCB: | 1.2 V ~ 3.6 V |
|---|---|
| 電壓 - VCCA: | 1.2 V ~ 3.6 V |
| 翻譯類型: | Voltage Level |
| 供應商設備封裝: | US8 |
| 系列: | 74AVC |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-VFSOP (0.091", 2.30mm Width) |
| 輸出類型: | Tri-State, Non-Inverted |
| 輸出信號: | - |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | SN74AVC2T45DCUTG4 |
| 輸入信號: | - |
| 特徵: | - |
| 展開說明: | Voltage Level Translator Bidirectional 1 Circuit 2 Channel 500Mbps US8 |
| 描述: | IC BUS TRANSCVR TRI-ST 2B US8 |
| 數據速率: | 500Mbps |
| 每路電路: | 2 |
| 基射極飽和電壓（最大值）: | Bidirectional |
| Email: | [email protected] |
SN74AVC2T45DCUTG4的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
SN74AVC2T45DCUT | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B US8 | 在線詢價 |
|
SN74AVC2T45DCUTE4 | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B US8 | 在線詢價 |
|
SN74AVC2T45YZPR | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B 8DSBGA | 在線詢價 |
|
SN74AVC2T45DCURE4 | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B US8 | 在線詢價 |
|
SN74AVC2T45YEPR | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B 8DSBGA | 在線詢價 |
|
SN74AVC2T45DCTR | Texas Instruments | IC BUS TXRX TRI-ST 2BIT SM8 | 在線詢價 |
|
SN74AVC2T45DCTRE4 | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B SM8 | 在線詢價 |
|
SN74AVC2T45DCURG4 | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B US8 | 在線詢價 |
|
SN74AVC2T45DCTTG4 | Texas Instruments | IC BUS TXRX TRI-ST 2BIT SM8 | 在線詢價 |
|
SN74AVC2T45DCUR | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B US8 | 在線詢價 |
|
SN74AVC2T45DCTT | Texas Instruments | IC BUS TRANSCVR TRI-ST 2B SM8 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers