購買 SN74AUP2G126YZPR與BYCHPS
購買即有保證
SN74AUP2G126YZPR
- 型號:
- SN74AUP2G126YZPR
- 製造商:
- 描述:
- IC BUFF/DVR 3ST DUAL LP 8DSBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16069 Pieces
簡單介紹
BYCHIPS是 SN74AUP2G126YZPR的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SN74AUP2G126YZPR購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 0.8 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 8-DSBGA, 8-WCSP (1.9x0.9) |
| 系列: | 74AUP |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-XFBGA, DSBGA |
| 輸出類型: | Push-Pull |
| 其他名稱: | 296-24738-2 SN74AUP2G126YZPR-ND |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 元素的數量: | 2 |
| 每個元件的位元數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 13 Weeks |
| 製造商零件編號: | SN74AUP2G126YZPR |
| 邏輯類型: | Buffer, Non-Inverting |
| 輸入類型: | - |
| 展開說明: | Buffer, Non-Inverting Element 1 Bit per Element Push-Pull Output 8-DSBGA, 8-WCSP (1.9x0.9) |
| 描述: | IC BUFF/DVR 3ST DUAL LP 8DSBGA |
| 電流 - 輸出高，低: | 4mA, 4mA |
| Email: | [email protected] |
SN74AUP2G126YZPR的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
SN74AUP2G126DCUR | Texas Instruments | IC BUS BUFFER 3ST DUAL LP US8 | 在線詢價 |
|
SN74AUP2G126RSER | Texas Instruments | IC BUFF/DVR 3ST DUAL LP 8UQFN | 在線詢價 |
|
SN74AUP2G17DSFR | Texas Instruments | IC BUFFER SCHMITT TRIG DL 6SON | 在線詢價 |
|
SN74AUP2G125YFPR | Texas Instruments | IC BUS BUFF TRI-ST DL 8DSBGA | 在線詢價 |
|
SN74AUP2G125YZPR | Texas Instruments | IC BUS BUFFER 3-ST DL LP 8DSBGA | 在線詢價 |
|
SN74AUP2G126DQER | Texas Instruments | IC BUFF/DVR 3ST DUAL LP 8X2SON | 在線詢價 |
|
SN74AUP2G126YFPR | Texas Instruments | IC BUFF/DVR 3ST DUAL LP 8DSBGA | 在線詢價 |
|
SN74AUP2G125DQER | Texas Instruments | IC BUS BUFFER 3ST DUAL LP 8X2SON | 在線詢價 |
|
SN74AUP2G125RSER | Texas Instruments | IC BUS BUFFER 3ST DUAL LP 8UQFN | 在線詢價 |
|
SN74AUP2G125DCUR | Texas Instruments | IC BUS BUFFER 3ST DUAL LP US8 | 在線詢價 |
|
SN74AUP2G14DSF2 | Texas Instruments | IC INVERTER SCHMITT TRIG 6-SON | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers