購買 SMP1330-085LF與BYCHPS
購買即有保證
SMP1330-085LF
- 型號:
- SMP1330-085LF
- 描述:
- DIODE RF PIN 50V 200MA 3QFN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14298 Pieces
簡單介紹
BYCHIPS是 SMP1330-085LF的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SMP1330-085LF購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 峰值反向（最大）: | 50V |
|---|---|
| 供應商設備封裝: | 3-QFN (2x2) |
| 系列: | - |
| 電阻@，女: | 2 Ohm @ 10mA, 100MHz |
| 功率耗散（最大）: | 3W |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 2-VDFN Exposed Pad |
| 其他名稱: | 863-1402-2 SMP1330085LF |
| 工作溫度: | 175°C (TJ) |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | SMP1330-085LF |
| 展開說明: | RF Diode PIN - Single 50V 200mA 3W 3-QFN (2x2) |
| 二極管類型: | PIN - Single |
| 描述: | DIODE RF PIN 50V 200MA 3QFN |
| 電流 - 最大: | 200mA |
| 電容@ Vr，F時: | 1pF @ 0V, 1MHz |
| Email: | [email protected] |
SMP1330-085LF的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers