購買 SK8603170L與BYCHPS
購買即有保證
SK8603170L
- 型號:
- SK8603170L
- 製造商:
- Panasonic
- 描述:
- MOSFET N-CH 30V 20A 8HSO
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12304 Pieces
- 數據表:
- SK8603170L.pdf
簡單介紹
BYCHIPS是 SK8603170L的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SK8603170L購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| VGS（TH）（最大）@標識: | 3V @ 2.56mA |
|---|---|
| Vgs（最大）: | ±20V |
| 技術: | MOSFET (Metal Oxide) |
| 供應商設備封裝: | 8-HSO |
| 系列: | - |
| RDS（ON）（最大值）@標識，柵極電壓: | 4.1 mOhm @ 14A, 10V |
| 功率耗散（最大）: | 2.8W (Ta), 24W (Tc) |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-SMD, Flat Lead |
| 其他名稱: | P16269TR |
| 工作溫度: | 150°C (TJ) |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 12 Weeks |
| 製造商零件編號: | SK8603170L |
| 輸入電容（Ciss）（Max）@ Vds: | 2940pF @ 10V |
| 柵極電荷（Qg）（Max）@ Vgs: | 17nC @ 4.5V |
| FET型: | N-Channel |
| FET特點: | - |
| 展開說明: | N-Channel 30V 20A (Ta), 59A (Tc) 2.8W (Ta), 24W (Tc) Surface Mount 8-HSO |
| 驅動電壓（最大Rds開，最小Rds開）: | 4.5V, 10V |
| 漏極至源極電壓（Vdss）: | 30V |
| 描述: | MOSFET N-CH 30V 20A 8HSO |
| 電流 - 25°C連續排水（Id）: | 20A (Ta), 59A (Tc) |
| Email: | [email protected] |
SK8603170L的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
SK8603190L | Panasonic Electronic Components | MOSFET N-CH 30V 12A 8HSO | 在線詢價 |
 |
RSD221N06TL | Rohm Semiconductor | MOSFET N-CH 60V 22A CPT3 | 在線詢價 |
|
SK8603150L | Panasonic Electronic Components | MOSFET N-CH 30V 26A 8HSO | 在線詢價 |
|
SK8603140L | Panasonic Electronic Components | MOSFET N-CH 30V 25A 8HSO | 在線詢價 |
 |
TK8A45DA(STA4,Q,M) | Toshiba Semiconductor and Storage | MOSFET N-CH 450V 7.5A TO-220SIS | 在線詢價 |
 |
AOT5N50_001 | Alpha & Omega Semiconductor Inc. | MOSFET N-CH 500V 5A TO-220 | 在線詢價 |
 |
IRF3709ZCS | Infineon Technologies | MOSFET N-CH 30V 87A D2PAK | 在線詢價 |
|
SK8603180L | Panasonic Electronic Components | MOSFET N-CH 30V 15A 8HSO | 在線詢價 |
 |
FDC642P_SB4N006 | ON Semiconductor | MOSFET N-CH SSOT6 | 在線詢價 |
|
SK8603160L | Panasonic Electronic Components | MOSFET N-CH 30V 22A 8HSO | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers