購買 SIDC02D60C6與BYCHPS
購買即有保證
SIDC02D60C6
- 型號:
- SIDC02D60C6
- 描述:
- DIODE GEN PURP 600V 6A WAFER
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 14466 Pieces
- 數據表:
- SIDC02D60C6.pdf
簡單介紹
BYCHIPS是 SIDC02D60C6的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的SIDC02D60C6購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 正向（Vf）（最大）: | 1.95V @ 6A |
|---|---|
| 電壓 - （Vr）（最大）: | 600V |
| 供應商設備封裝: | Sawn on foil |
| 速度: | Standard Recovery >500ns, > 200mA (Io) |
| 系列: | - |
| 封装: | Bulk |
| 封裝/箱體: | Die |
| 其他名稱: | SP000014997 |
| 工作溫度 - 結: | -40°C ~ 175°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | SIDC02D60C6 |
| 展開說明: | Diode Standard 600V 6A (DC) Surface Mount Sawn on foil |
| 二極管類型: | Standard |
| 描述: | DIODE GEN PURP 600V 6A WAFER |
| 電流 - Vr時反向漏電: | 27µA @ 600V |
| 電流 - 平均整流（Io）: | 6A (DC) |
| 電容@ Vr，F時: | - |
| Email: | [email protected] |
SIDC02D60C6的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers