購買 RT114012與BYCHPS
購買即有保證
RT114012
- 型號:
- RT114012
- 描述:
- RELAY GEN PURPOSE SPDT 12A 12V
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18013 Pieces
簡單介紹
BYCHIPS是 RT114012的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的RT114012購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 開啟電壓（最大值）: | 8.4 VDC |
|---|---|
| 關閉電壓（最小）: | 1.2 VDC |
| 端接類型: | PC Pin |
| 切換電壓: | 400VAC - Max |
| 系列: | RT1, SCHRACK |
| 發布時間: | 6ms |
| 繼電器類型: | General Purpose |
| 封装: | Tube |
| 其他名稱: | 1419108-1 PB2140 RT114012-ND |
| 工作溫度: | -40°C ~ 85°C |
| 操作時間: | 8ms |
| 安裝類型: | Through Hole |
| 製造商標準交貨期: | 17 Weeks |
| 製造商零件編號: | RT114012 |
| 特徵: | Insulation - Class F, Sealed - Flux Protection |
| 展開說明: | General Purpose Relay SPDT (1 Form C) 12VDC Coil Through Hole |
| 描述: | RELAY GEN PURPOSE SPDT 12A 12V |
| 觸點額定值（電流）: | 12A |
| 觸點材料: | Silver Nickel (AgNi) |
| 聯繫表: | SPDT (1 Form C) |
| 線圈電壓: | 12VDC |
| 線圈類型: | Non Latching |
| 線圈電阻: | 360 Ohms |
| 線圈功率: | 400 mW |
| 線圈電流: | 33.3mA |
| Email: | [email protected] |
RT114012的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
RT114009 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | 在線詢價 |
|
RT114060 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 60V | 在線詢價 |
 |
RT114024F | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 24V | 在線詢價 |
 |
RT114006 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 6V | 在線詢價 |
 |
RT114024 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 24V | 在線詢價 |
|
RT114018 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | 在線詢價 |
|
RT114048 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 48V | 在線詢價 |
|
RT114012F | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 12V | 在線詢價 |
 |
RT114615 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 115V | 在線詢價 |
 |
RT114005 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 12A 5V | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers