購買 RLF12545T-4R2N6R5-PF與BYCHPS
購買即有保證
RLF12545T-4R2N6R5-PF
- 型號:
- RLF12545T-4R2N6R5-PF
- 製造商:
- TDK Corporation
- 描述:
- FIXED IND 4.2UH 6.5A 7.4 MOHM
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 20091 Pieces
簡單介紹
BYCHIPS是 RLF12545T-4R2N6R5-PF的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的RLF12545T-4R2N6R5-PF購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 類型: | Wirewound |
|---|---|
| 公差: | ±30% |
| 供應商設備封裝: | - |
| 尺寸/尺寸: | 0.504" L x 0.492" W (12.80mm x 12.50mm) |
| 屏蔽: | Shielded |
| 系列: | RLF |
| 評級: | - |
| Q因子@頻率: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | Nonstandard |
| 其他名稱: | 445-2950-2 RLF12545T-4R2N6R5 RLF12545T-4R2N6R5-ND RLF12545T4R2N6R5PF |
| 工作溫度: | -40°C ~ 105°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 材料 - 核: | Ferrite |
| 製造商標準交貨期: | 14 Weeks |
| 製造商零件編號: | RLF12545T-4R2N6R5-PF |
| 電感: | 4.2µH |
| 高度 - 座高（最大）: | 0.185" (4.70mm) |
| 頻率 - 測試: | 100kHz |
| 頻率 - 自諧振: | - |
| 展開說明: | 4.2µH Shielded Wirewound Inductor 6.5A 8.88 mOhm Max Nonstandard |
| 描述: | FIXED IND 4.2UH 6.5A 7.4 MOHM |
| 直流電阻（DCR）: | 8.88 mOhm Max |
| 目前評級: | 6.5A |
| 電流 - 飽和: | 9.5A |
| Email: | [email protected] |
RLF12545T-4R2N6R5-PF的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
RLF12545T-7R8N5R4-PF | TDK Corporation | FIXED IND 7.8UH 5.4A 10.2 MOHM | 在線詢價 |
|
RLF12545T-2R7N8R7-PF | TDK Corporation | FIXED IND 2.7UH 8.7A 4.5 MOHM | 在線詢價 |
|
RLF12545T-1R9N100-PF | TDK Corporation | FIXED IND 1.9UH 10.5A 3.6 MOHM | 在線詢價 |
|
RLF12545T-5R6N6R1-PF | TDK Corporation | FIXED IND 5.6UH 6.1A 8.5 MOHM | 在線詢價 |
 |
RLF12560T-100M7R5 | TDK Corporation | FIXED IND 10UH 7.8A 12.4 MOHM | 在線詢價 |
|
RLF12560T-2R7N110 | TDK Corporation | FIXED IND 2.7UH 11.5A 4.5 MOHM | 在線詢價 |
|
RLF12545T-100M5R1-PF | TDK Corporation | FIXED IND 10UH 5.1A 12.4 MOHM | 在線詢價 |
|
RLF12560T-5R6N9R2 | TDK Corporation | FIXED IND 5.6UH 9.2A 8.5 MOHM | 在線詢價 |
|
RLF12560T-4R2N100 | TDK Corporation | FIXED IND 4.2UH 10A 7.4 MOHM SMD | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers