購買 RGTH00TS65GC11與BYCHPS
購買即有保證
RGTH00TS65GC11
- 型號:
- RGTH00TS65GC11
- 描述:
- IGBT 650V 85A 277W TO-247N
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 12643 Pieces
簡單介紹
BYCHIPS是 RGTH00TS65GC11的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的RGTH00TS65GC11購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 650V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.1V @ 15V, 50A |
| 測試條件: | 400V, 50A, 10 Ohm, 15V |
| Td（開/關）@ 25°C: | 39ns/143ns |
| 開關能量: | - |
| 供應商設備封裝: | TO-247N |
| 系列: | - |
| 功率 - 最大: | 277W |
| 封装: | Tube |
| 封裝/箱體: | TO-247-3 |
| 工作溫度: | -40°C ~ 175°C (TJ) |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 15 Weeks |
| 製造商零件編號: | RGTH00TS65GC11 |
| 輸入類型: | Standard |
| IGBT類型: | Trench Field Stop |
| 柵極電荷: | 94nC |
| 展開說明: | IGBT Trench Field Stop 650V 85A 277W Through Hole TO-247N |
| 描述: | IGBT 650V 85A 277W TO-247N |
| 電流 - 集電極脈衝（ICM）: | 200A |
| 電流 - 集電極（Ic）（最大）: | 85A |
| Email: | [email protected] |
RGTH00TS65GC11的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
RGTH00TS65DGC11 | Rohm Semiconductor | IGBT 650V 85A 277W TO-247N | 在線詢價 |
 |
RJP60D0DPP-M0#T2 | Renesas Electronics America | IGBT 600V 45A 35W TO-220FL | 在線詢價 |
 |
IHD06N60RA | Infineon Technologies | IGBT 600V 12A 88W TO252-3 | 在線詢價 |
 |
APT15GT60BRDQ1G | Microsemi Corporation | IGBT 600V 42A 184W TO247 | 在線詢價 |
 |
IRG4PC40FPBF | Infineon Technologies | IGBT 600V 49A 160W TO247AC | 在線詢價 |
 |
FGB3040CS | Fairchild/ON Semiconductor | IGBT 430V 21A 150W TO263-6 | 在線詢價 |
 |
HGT1S12N60A4DS | Fairchild/ON Semiconductor | IGBT 600V 54A 167W D2PAK | 在線詢價 |
|
APT25GT120BRG | Microsemi Corporation | IGBT 1200V 54A 347W TO247 | 在線詢價 |
|
IRG4PC60U-PPBF | Infineon Technologies | IGBT 600V 75A 520W TO247AC | 在線詢價 |
 |
IKW50N65H5AXKSA1 | Infineon Technologies | IGBT 650V 80A 305W PG-TO247-3 | 在線詢價 |
 |
NGB8207ANT4G | ON Semiconductor | IGBT 365V 20A 165W D2PAK3 | 在線詢價 |
 |
STGWT40H65FB | STMicroelectronics | IGBT 650V 80A 283W TO3P-3L | 在線詢價 |
 |
IXGP42N30C3 | IXYS | IGBT 300V 223W TO220AB | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers