購買 R8A77220AC266BAV與BYCHPS
購買即有保證
R8A77220AC266BAV
- 型號:
- R8A77220AC266BAV
- 描述:
- IC MCU 32BIT ROMLESS 417LFBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14336 Pieces
簡單介紹
BYCHIPS是 R8A77220AC266BAV的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的R8A77220AC266BAV購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源（Vcc / VDD）: | 1.15 V ~ 1.3 V |
|---|---|
| 供應商設備封裝: | 417-LFBGA (13x13) |
| 速度: | 266MHz |
| 系列: | SuperH® SH7700 |
| RAM容量: | 148K x 8 |
| 程序存儲器類型: | ROMless |
| 程序存儲器大小: | - |
| 外設: | DMA, LCD, PWM, WDT |
| 封装: | Tray |
| 封裝/箱體: | 417-LFBGA |
| 振盪器型: | External |
| 工作溫度: | -20°C ~ 75°C (TA) |
| I / O數量: | 184 |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商零件編號: | R8A77220AC266BAV |
| 展開說明: | SH-4A SuperH® SH7700 Microcontroller IC 32-Bit 266MHz ROMless 417-LFBGA (13x13) |
| EEPROM容量: | - |
| 描述: | IC MCU 32BIT ROMLESS 417LFBGA |
| 數據轉換器: | - |
| 核心尺寸: | 32-Bit |
| 核心處理器: | SH-4A |
| 連通性: | I²C, IrDA, SCI, SIO, SSU, USB |
| Email: | [email protected] |
R8A77220AC266BAV的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
R8A77450HA01BG#UA | Renesas Electronics America | RZ/G1-E DUAL CORE ARM CORTEX-A7 | 在線詢價 |
 |
R8A77210C133BAV | Renesas Electronics America | IC MCU 32BIT ROMLESS 256LFBGA | 在線詢價 |
|
R8A77210C133BGV | Renesas Electronics America | IC MCU 32BIT ROMLESS 256CSP | 在線詢價 |
 |
R8A77800BNBGV | Renesas Electronics America | IC MCU 32BIT ROMLESS 449FBGA | 在線詢價 |
|
R8A77220AC266BGV | Renesas Electronics America | IC MCU 32BIT ROMLESS 449FBGA | 在線詢價 |
|
R8A77440HA01BG#UA | Renesas Electronics America | RZ/G1-N DUAL CORE ARM CORTEX-A15 | 在線詢價 |
|
R8A77240D500BG#U0 | Renesas Electronics America | IC MCU 32BIT ROMLESS 449FBGA | 在線詢價 |
|
R8A77230C400BG | Renesas Electronics America | IC MCU 32BIT ROMLESS 449FBGA | 在線詢價 |
|
R8A77430HA01BG#UA | Renesas Electronics America | RZ/G1-M DUAL CORE ARM CORTEX-A15 | 在線詢價 |
|
R8A77800BDBGV | Renesas Electronics America | IC MCU 32BIT ROMLESS 449FBGA | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers