購買 R2A20056BM#W0與BYCHPS
購買即有保證
R2A20056BM#W0
- 型號:
- R2A20056BM#W0
- 描述:
- IC CHRGR LIION
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13634 Pieces
簡單介紹
BYCHIPS是 R2A20056BM#W0的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的R2A20056BM#W0購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 最大值: | 5.5V |
|---|---|
| 供應商設備封裝: | 25-BGA (2.17x2.27) |
| 系列: | - |
| 可編程功能: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 25-WFBGA |
| 工作溫度: | -30°C ~ 85°C (TA) |
| 細胞數: | 1 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | R2A20056BM#W0 |
| 接口: | I²C, USB |
| 故障保護: | Over Temperature, Over Voltage |
| 展開說明: | Charger IC Lithium-Ion 25-BGA (2.17x2.27) |
| 描述: | IC CHRGR LIION |
| 電流充電: | - |
| 充電電流 - 最大: | 1A |
| 電池組電壓: | 4.2V |
| 電池化學成分: | Lithium-Ion |
| Email: | [email protected] |
R2A20056BM#W0的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers