購買 PF38F3050M0Y3DEA與BYCHPS
購買即有保證
PF38F3050M0Y3DEA
- 型號:
- PF38F3050M0Y3DEA
- 描述:
- IC FLASH 128MBIT 133MHZ 56SCSP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16488 Pieces
簡單介紹
BYCHIPS是 PF38F3050M0Y3DEA的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的PF38F3050M0Y3DEA購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 1.7 V ~ 2 V |
|---|---|
| 供應商設備封裝: | 56-SCSP |
| 速度: | 133MHz |
| 系列: | - |
| 封装: | Tray |
| 封裝/箱體: | 56-TFBGA, CSPBGA |
| 其他名稱: | 896724 896724-ND PF38F3050M0Y3DE PF38F3050M0Y3DE 896724 |
| 工作溫度: | -30°C ~ 85°C (TA) |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 內存類型: | Non-Volatile |
| 內存大小: | 128Mb (8M x 16) |
| 內存格式: | FLASH |
| 製造商零件編號: | PF38F3050M0Y3DEA |
| 接口: | Parallel |
| 描述: | IC FLASH 128MBIT 133MHZ 56SCSP |
| Email: | [email protected] |
PF38F3050M0Y3DEA的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
PF38F3050M0Y0CEA | Micron Technology Inc. | IC FLASH 192M | 在線詢價 |
 |
CAV24C256WE-GT3 | ON Semiconductor | IC EEPROM 256KBIT 1MHZ 8SOIC | 在線詢價 |
 |
PF38F4050M0Y3CFA | Micron Technology Inc. | IC FLASH 256MBIT 133MHZ 107SCSP | 在線詢價 |
|
PF38F3050M0Y0CEB TR | Micron Technology Inc. | IC FLASH 192M | 在線詢價 |
 |
M25P20-VMP6TG TR | Micron Technology Inc. | IC FLASH 2MBIT 50MHZ 8VFDFPN | 在線詢價 |
|
EDFP112A3PB-GDTJ-F-R | Micron Technology Inc. | LPDDR3 24G 192MX128 FBGA QDP | 在線詢價 |
 |
PF38F5060M0Y0BEA | Micron Technology Inc. | IC FLASH 512MBIT 133MHZ 105SCSP | 在線詢價 |
 |
MT48LC64M8A2P-75:C | Micron Technology Inc. | IC SDRAM 512MBIT 133MHZ 54TSOP | 在線詢價 |
 |
MT29F64G08CBCABH1-12Z:A TR | Micron Technology Inc. | IC FLASH 64GBIT 83MHZ 100VBGA | 在線詢價 |
 |
MX25L1006EZUI-10G | Macronix | IC FLASH 1MBIT 104MHZ 8USON | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers