購買 PAS1235LA3R0206與BYCHPS
購買即有保證
PAS1235LA3R0206
- 型號:
- PAS1235LA3R0206
- 製造商:
- Taiyo Yuden
- 描述:
- CAP 20F 20% 3V THROUGH HOLE
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18714 Pieces
簡單介紹
BYCHIPS是 PAS1235LA3R0206的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的PAS1235LA3R0206購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 額定: | 3V |
|---|---|
| 公差: | ±20% |
| 終止: | Through Hole |
| 尺寸/尺寸: | 0.492" Dia (12.50mm) |
| 系列: | LA |
| 封装: | Bulk |
| 封裝/箱體: | Radial, Can |
| 其他名稱: | 587-2023 CP PAS1235LA3R0206 |
| 工作溫度: | -25°C ~ 60°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 9 Weeks |
| 製造商零件編號: | PAS1235LA3R0206 |
| 壽命@溫度。: | - |
| 引線間距: | 0.197" (5.00mm) |
| 高度 - 座高（最大）: | 1.457" (37.00mm) |
| 展開說明: | 20F ±20%(EDLC) Supercapacitor 3V Radial, Can 100 mOhm |
| ESR（等效串聯電阻）: | 100 mOhm |
| 描述: | CAP 20F 20% 3V THROUGH HOLE |
| 電容: | 20F |
| Email: | [email protected] |
PAS1235LA3R0206的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
BCAP2000 P270 K04 | Maxwell Technologies Inc. | CAP 2000F 2.7V THREADED | 在線詢價 |
 |
PAS1235LA2R3226 | Taiyo Yuden | CAP 22F 20% 2.3V THROUGH HOLE | 在線詢價 |
 |
EEC-S0HD104V | Panasonic Electronic Components | CAP 100MF -20% +80% 5.5V T/H | 在線詢價 |
 |
EEC-F5R5U474 | Panasonic Electronic Components | CAP 470MF -20% +80% 5.5V T/H | 在線詢價 |
|
PAS1220LA3R0905 | Taiyo Yuden | CAP 9F 20% 3V THROUGH HOLE | 在線詢價 |
|
EEC-S0HD224V | Panasonic Electronic Components | CAP 220MF -20% +80% 5.5V T/H | 在線詢價 |
 |
BZ023A564ZAB | AVX Corporation | CAP 560MF -20% +80% 3.6V T/H | 在線詢價 |
 |
JJC0E128MSEFBN | Nichicon | CAP 1200F 20% 2.5V CHASSIS MOUNT | 在線詢價 |
 |
PAS1220LN2R7905 | Taiyo Yuden | CAP 9F 20% 2.7V THROUGH HOLE | 在線詢價 |
 |
SCCS25B705SRB | AVX Corporation | CAPACITOR 7F 2.7V THRU HOLE | 在線詢價 |
|
PAS1220LA2R3106 | Taiyo Yuden | CAP 10F 20% 2.3V THROUGH HOLE | 在線詢價 |
 |
B48621A9115Q024 | EPCOS (TDK) | CAP 110F -10% +30% 56V CHAS MNT | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers