購買 OSOPA1001AT1與BYCHPS
購買即有保證
OSOPA1001AT1
- 型號:
- OSOPA1001AT1
- 描述:
- RES ARRAY 10 RES 1K OHM 20SSOP
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 13991 Pieces
- 數據表:
- OSOPA1001AT1.pdf
簡單介紹
BYCHIPS是 OSOPA1001AT1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的OSOPA1001AT1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 公差: | ±0.1% |
|---|---|
| 溫度係數: | ±25ppm/°C |
| 供應商設備封裝: | - |
| 尺寸/尺寸: | 0.344" L x 0.154" W (8.74mm x 3.91mm) |
| 系列: | OSOP |
| 電阻（歐姆）: | 1k |
| 每個元件的功率: | 100mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 20-SSOP (0.154", 3.90mm Width) |
| 工作溫度: | -55°C ~ 125°C |
| 電阻數: | 10 |
| 引腳數目: | 20 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | OSOPA1001AT1 |
| 高度 - 座高（最大）: | 0.068" (1.73mm) |
| 展開說明: | 1k Ohm ±0.1% 100mW Power Per Element Isolated Resistor Network/Array ±25ppm/°C 20-SSOP (0.154", 3.90mm Width) |
| 描述: | RES ARRAY 10 RES 1K OHM 20SSOP |
| 電路類型: | Isolated |
| 應用: | - |
| Email: | [email protected] |
OSOPA1001AT1的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
OSOPA5001AT1 | Vishay Thin Film | RES ARRAY 10 RES 5K OHM 20SSOP | 在線詢價 |
|
OSOPA1002AT1 | Vishay Thin Film | RES ARRAY 10 RES 10K OHM 20SSOP | 在線詢價 |
|
OSOPA1002BUF | Vishay Thin Film | RES ARRAY 10 RES 10K OHM 20SSOP | 在線詢價 |
|
OSOPA1003AT1 | Vishay Thin Film | RES ARRAY 10 RES 100K OHM 20SSOP | 在線詢價 |
|
OSOPA2001AT1 | Vishay Thin Film | RES ARRAY 10 RES 2K OHM 20SSOP | 在線詢價 |
 |
752085500AP | CTS Resistor Products | RES NTWRK 12 RES MULT OHM 8SRT | 在線詢價 |
|
OSOPA5002AT1 | Vishay Thin Film | RES ARRAY 10 RES 50K OHM 20SSOP | 在線詢價 |
 |
4610X-102-181 | Bourns Inc. | RES ARRAY 5 RES 180 OHM 10SIP | 在線詢價 |
 |
742C163474JP | CTS Resistor Products | RES ARRAY 8 RES 470K OHM 2506 | 在線詢價 |
|
OSOPA5000BT1 | Vishay Thin Film | RES ARRAY 10 RES 500 OHM 20SSOP | 在線詢價 |
|
OSOPA2002AT1 | Vishay Thin Film | RES ARRAY 10 RES 20K OHM 20SSOP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers