購買 OPA548F/500與BYCHPS
購買即有保證
OPA548F/500
- 型號:
- OPA548F/500
- 製造商:
- 描述:
- IC OPAMP POWER 1MHZ DDPAK
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19910 Pieces
- 數據表:
- OPA548F/500.pdf
簡單介紹
BYCHIPS是 OPA548F/500的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的OPA548F/500購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 單/雙（±）: | 8 V ~ 60 V, ±4 V ~ 30 V |
|---|---|
| 電壓 - 輸入偏移: | 2mV |
| 供應商設備封裝: | DDPAK/TO-263-7 |
| 壓擺率: | 10 V/µs |
| 系列: | - |
| 封装: | Original-Reel® |
| 封裝/箱體: | TO-263-8, D²Pak (7 Leads + Tab), TO-263CA |
| 輸出類型: | - |
| 其他名稱: | 296-26290-6 |
| 工作溫度: | -40°C ~ 85°C |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 2 (1 Year) |
| 製造商標準交貨期: | 6 Weeks |
| 製造商零件編號: | OPA548F/500 |
| 增益帶寬積: | 1MHz |
| 展開說明: | Power Amplifier 1 Circuit DDPAK/TO-263-7 |
| 描述: | IC OPAMP POWER 1MHZ DDPAK |
| 供電: | 17mA |
| 電流 - 輸出/通道: | 5A |
| 電流 - 輸入偏置: | 100nA |
| 放大器類型: | Power |
| -3db帶寬: | - |
| Email: | [email protected] |
OPA548F/500的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
|
OPA548FKTWTG3 | Texas Instruments | IC OPAMP POWER 1MHZ DDPAK | 在線詢價 |
|
OPA548F/500G3 | Texas Instruments | IC OPAMP POWER 1MHZ DDPAK | 在線詢價 |
|
OPA541APG3 | Texas Instruments | IC OPAMP POWER 1.6MHZ TO220-11 | 在線詢價 |
|
OPA548T-1G3 | Texas Instruments | IC OPAMP POWER 1MHZ TO220-7 | 在線詢價 |
|
OPA548TG3 | Texas Instruments | IC OPAMP POWER 1MHZ TO220-7 | 在線詢價 |
|
OPA548FKTWT | Texas Instruments | IC OPAMP POWER 1MHZ DDPAK | 在線詢價 |
|
OPA549TG3 | Texas Instruments | IC OPAMP POWER 900KHZ TO220-11 | 在線詢價 |
|
OPA541AM | Texas Instruments | IC OPAMP PWR 1.6MHZ SGL TO-3-8 | 在線詢價 |
|
OPA548T | Texas Instruments | IC OPAMP POWER 1MHZ TO220-7 | 在線詢價 |
|
OPA547FKTWTG3 | Texas Instruments | IC OPAMP GP 1MHZ DDPAK | 在線詢價 |
|
OPA548T-1 | Texas Instruments | IC OPAMP POWER 1MHZ TO220-7 | 在線詢價 |
|
OPA549SG3 | Texas Instruments | IC OPAMP POWER 900KHZ 11PWRPACK | 在線詢價 |
|
OPA547T-1 | Texas Instruments | IC OPAMP GP 1MHZ TO220-7 | 在線詢價 |
|
OPA544F/500 | Texas Instruments | IC OPAMP POWER 1.4MHZ DDPAK | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers