購買 NL3S588MUTBG與BYCHPS
購買即有保證
NL3S588MUTBG
- 型號:
- NL3S588MUTBG
- 描述:
- IC SWITCH AUDIO USB DPDT 10UQFN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13775 Pieces
- 數據表:
- NL3S588MUTBG.pdf
簡單介紹
BYCHIPS是 NL3S588MUTBG的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NL3S588MUTBG購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓，單（V +）: | 3 V ~ 3.6 V |
|---|---|
| 電壓 - 雙通道（V±）: | - |
| 開關電路: | DPDT |
| 供應商設備封裝: | 10-UQFN (1.4x1.8) |
| 系列: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 10-UFQFN |
| 其他名稱: | NL3S588MUTBGOSTR |
| 工作溫度: | -40°C ~ 85°C (TA) |
| 通態電阻（最大值）: | 2.1 Ohm (Typ) |
| 通道數: | 2 |
| 多路復用器/解復用器電路: | 2:2 |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | NL3S588MUTBG |
| 特徵: | USB 2.0 |
| 展開說明: | Audio, USB Switch IC 2 Channel 10-UQFN (1.4x1.8) |
| 描述: | IC SWITCH AUDIO USB DPDT 10UQFN |
| 應用: | Audio, USB |
| -3db帶寬: | 580MHz |
| Email: | [email protected] |
NL3S588MUTBG的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
NX5DV330D,112 | NXP USA Inc. | IC VIDEO MUX/DEMUX 1X2 16SOIC | 在線詢價 |
 |
HV2201FG-G-M931 | Microchip Technology | IC 8CH ANALOG SWITCH 48LQFP | 在線詢價 |
 |
PI3L500-AZFE | Diodes Incorporated | IC MUX/DEMUX 8 X 2:1 56TQFN | 在線詢價 |
 |
ISL54225IRUZ-T7A | Intersil | IC MULTIPLEXER DUAL 2:1 10TQFN | 在線詢價 |
 |
MAX4888AETI/V+T | Maxim Integrated | IC SWITCH QUAD SPDT 28TQFN | 在線詢價 |
 |
AD8176ABPZ | Analog Devices Inc. | IC VIDEO CROSSPOINT SWIT 676BGA | 在線詢價 |
 |
MAX311CWN | Maxim Integrated | IC VIDEO MULTIPLEXER 4X1 18SOIC | 在線詢價 |
 |
MAX4563EEE+ | Maxim Integrated | IC AUD/VID SWITCH SPI SER 16QSOP | 在線詢價 |
 |
FSA2000UMX | Fairchild/ON Semiconductor | IC HS-USB/AUDIO SWITCH 16UMLP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers