購買 NJU7082BV-TE1與BYCHPS
購買即有保證
NJU7082BV-TE1
- 型號:
- NJU7082BV-TE1
- 描述:
- IC OPAMP AUDIO 8SSOP
- 無鉛狀態/ RoHS狀態:
- 包含鉛/ RoHS不兼容
- 庫存數量:
- 20780 Pieces
簡單介紹
BYCHIPS是 NJU7082BV-TE1的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NJU7082BV-TE1購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 單/雙（±）: | 2.4 V ~ 5.5 V |
|---|---|
| 電壓 - 輸入偏移: | 10mV |
| 供應商設備封裝: | 8-SSOP |
| 壓擺率: | 1 V/µs |
| 系列: | - |
| 封装: | Original-Reel® |
| 封裝/箱體: | 8-LSSOP (0.173", 4.40mm Width) |
| 輸出類型: | - |
| 其他名稱: | NJU7082BV-TE1DKR |
| 工作溫度: | -25°C ~ 75°C |
| 電路數: | 2 |
| 安裝類型: | Surface Mount |
| 製造商零件編號: | NJU7082BV-TE1 |
| 展開說明: | Audio Amplifier 2 Circuit 8-SSOP |
| 描述: | IC OPAMP AUDIO 8SSOP |
| 供電: | 3mA |
| 電流 - 輸出/通道: | 30mA |
| 電流 - 輸入偏置: | 10pA |
| 放大器類型: | Audio |
| -3db帶寬: | - |
| Email: | [email protected] |
NJU7082BV-TE1的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers