購買 NJM2122D#與BYCHPS
購買即有保證
NJM2122D#
- 型號:
- NJM2122D#
- 描述:
- IC OPAMP GP 12MHZ 8DIP
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 16509 Pieces
- 數據表:
- NJM2122D#.pdf
簡單介紹
BYCHIPS是 NJM2122D#的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NJM2122D#購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 單/雙（±）: | ±2 V ~ 10 V |
|---|---|
| 電壓 - 輸入偏移: | 1mV |
| 供應商設備封裝: | 8-DIP |
| 壓擺率: | 2.4 V/µs |
| 系列: | - |
| 封装: | Tube |
| 封裝/箱體: | 8-DIP (0.300", 7.62mm) |
| 輸出類型: | - |
| 其他名稱: | NJM#2122D NJM#2122D-ND |
| 工作溫度: | -20°C ~ 75°C |
| 電路數: | 2 |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 12 Weeks |
| 製造商零件編號: | NJM2122D# |
| 增益帶寬積: | 12MHz |
| 展開說明: | General Purpose Amplifier 2 Circuit 8-DIP |
| 描述: | IC OPAMP GP 12MHZ 8DIP |
| 供電: | 7mA |
| 電流 - 輸出/通道: | - |
| 電流 - 輸入偏置: | 3.6µA |
| 放大器類型: | General Purpose |
| -3db帶寬: | - |
| Email: | [email protected] |
NJM2122D#的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
NJM2136M | NJR Corporation/NJRC | IC OPAMP GP 200MHZ 8DMP | 在線詢價 |
|
NJM2119M | NJR Corporation/NJRC | IC OPAMP GP 1MHZ 8DMP | 在線詢價 |
|
NJM2120M# | NJR Corporation/NJRC | IC OPAMP GP 7MHZ 8DMP | 在線詢價 |
|
NJM2122M | NJR Corporation/NJRC | IC OPAMP GP 12MHZ 8DMP | 在線詢價 |
|
NJM2113M | NJR Corporation/NJRC | IC AUDIO POWER AMP LOW-VOLT 8DMP | 在線詢價 |
|
NJM2120D | NJR Corporation/NJRC | IC OPAMP GP 7MHZ 8DIP | 在線詢價 |
|
NJM2122D | NJR Corporation/NJRC | IC OPAMP GP 12MHZ 8DIP | 在線詢價 |
|
NJM2120M | NJR Corporation/NJRC | IC OPAMP GP 7MHZ 8DMP | 在線詢價 |
|
NJM2125F-TE1 | NJR Corporation/NJRC | IC OPAMP GP 1.2MHZ SOT23-5 | 在線詢價 |
|
NJM2113D | NJR Corporation/NJRC | IC AUDIO POWER AMP LOW-VOLT 8DIP | 在線詢價 |
|
NJM2121M | NJR Corporation/NJRC | IC OPAMP GP 14MHZ 8DMP | 在線詢價 |
|
NJM2100D | NJR Corporation/NJRC | IC OPAMP GP 12MHZ 8DIP | 在線詢價 |
|
NJM2121M# | NJR Corporation/NJRC | IC OPAMP GP 14MHZ 8DMP | 在線詢價 |
|
NJM2123D | NJR Corporation/NJRC | IC OPAMP GP 10MHZ 16DIP | 在線詢價 |
|
NJM2121D | NJR Corporation/NJRC | IC OPAMP GP 14MHZ 8DIP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers