購買 NCV891330PD33R2G與BYCHPS
購買即有保證
NCV891330PD33R2G
- 型號:
- NCV891330PD33R2G
- 描述:
- IC REG BUCK 3.3V 3A 8SOIC
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17928 Pieces
簡單介紹
BYCHIPS是 NCV891330PD33R2G的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NCV891330PD33R2G購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 輸出（最小/固定）: | 3.3V |
|---|---|
| 電壓 - 輸出（最大）: | - |
| 電壓 - 輸入（最小值）: | 3.7V |
| 電壓 - 輸入（最大）: | 36V |
| 拓撲: | Buck |
| 同步整流: | No |
| 供應商設備封裝: | 8-SOIC-EP |
| 系列: | Automotive, AEC-Q100 |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| 輸出類型: | Fixed |
| 輸出配置: | Positive |
| 工作溫度: | -40°C ~ 150°C (TJ) |
| 輸出端數量: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 2 (1 Year) |
| 製造商標準交貨期: | 18 Weeks |
| 製造商零件編號: | NCV891330PD33R2G |
| 功能: | Step-Down |
| 頻率 - 開關: | 2MHz |
| 展開說明: | Buck Switching Regulator IC Positive Fixed 3.3V 1 Output 3A 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| 描述: | IC REG BUCK 3.3V 3A 8SOIC |
| 電流 - 輸出: | 3A |
| Email: | [email protected] |
NCV891330PD33R2G的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
NCV891330PD38R2G | ON Semiconductor | IC REG BUCK 3.8V 3A 8SOIC | 在線詢價 |
|
NCV891330PD50R2G | ON Semiconductor | IC REG BUCK 5V 3A 8SOIC | 在線詢價 |
|
NCV891330PD40R2G | ON Semiconductor | IC REG BUCK 3.8V 3A 8SOIC | 在線詢價 |
|
NCV891130PD40R2G | ON Semiconductor | IC REG BUCK 3.3V 1.2A 8SOIC | 在線詢價 |
 |
NCV891334MW50R2G | ON Semiconductor | IC REG CTRLR BUCK 12DFN | 在線詢價 |
|
NCV891130PD50R2G | ON Semiconductor | IC REG BUCK 3.3V 1.2A 8SOIC | 在線詢價 |
|
NCV891234MW50R2G | ON Semiconductor | IC REG CTRLR BUCK 12DFN | 在線詢價 |
|
NCV891130PD33R2G | ON Semiconductor | IC REG BUCK 3.3V 1.2A 8SOIC | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers