購買 NB4N111KMNG與BYCHPS
購買即有保證
NB4N111KMNG
- 型號:
- NB4N111KMNG
- 描述:
- IC CLK BUFFER 1:10 400MHZ 32QFN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17741 Pieces
- 數據表:
- NB4N111KMNG.pdf
簡單介紹
BYCHIPS是 NB4N111KMNG的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的NB4N111KMNG購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源: | 3 V ~ 3.6 V |
|---|---|
| 類型: | Fanout Buffer (Distribution) |
| 供應商設備封裝: | 32-QFN (5x5) |
| 系列: | - |
| 比率 - 輸入：輸出: | 1:10 |
| 封装: | Tube |
| 封裝/箱體: | 32-VFQFN Exposed Pad |
| 產量: | HCSL |
| 其他名稱: | NB4N111KMNG-ND NB4N111KMNGOS |
| 工作溫度: | -40°C ~ 70°C |
| 電路數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 4 Weeks |
| 製造商零件編號: | NB4N111KMNG |
| 輸入: | CML, LVCMOS, LVDS, LVPECL, LVTTL |
| 頻率 - 最大: | 400MHz |
| 展開說明: | Clock Fanout Buffer (Distribution) IC 400MHz 32-VFQFN Exposed Pad |
| 差分 - 輸入：輸出: | Yes/Yes |
| 描述: | IC CLK BUFFER 1:10 400MHZ 32QFN |
| Email: | [email protected] |
NB4N111KMNG的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
8530DYI-01LFT | IDT, Integrated Device Technology Inc | IC CLK BUF 1:16 500MHZ 48PTQFP | 在線詢價 |
 |
8S89831AKILFT | IDT, Integrated Device Technology Inc | IC CLK BUF 1:4 2.1GHZ 16VFQFPN | 在線詢價 |
 |
NBSG14BA | ON Semiconductor | IC CLK BUFFER 1:4 12GHZ 16FCBGA | 在線詢價 |
 |
NB4N11SMNG | ON Semiconductor | IC BUFFER/XLATOR LVDS 16-QFN | 在線詢價 |
 |
NB4N11MDTG | ON Semiconductor | IC RCVR/BUFF/XLATOR MULTI 8TSSOP | 在線詢價 |
 |
NB4N1158DTG | ON Semiconductor | IC CLK LINK REPLICATOR HDTV | 在線詢價 |
 |
NB4N111KMNR4G | ON Semiconductor | IC CLK BUFFER 1:10 400MHZ 32QFN | 在線詢價 |
|
NB4N1158DTR2G | ON Semiconductor | IC CLK LINK REPLICATOR HDTV | 在線詢價 |
|
NB4N11MDTR2G | ON Semiconductor | IC RCVR/BUFF/XLATOR MULTI 8TSSOP | 在線詢價 |
|
NB4N11SMNR2G | ON Semiconductor | IC BUFFER/XLATOR LVDS 16-QFN | 在線詢價 |
 |
NB4N121KMNR2G | ON Semiconductor | IC CLK BUFFER 1:21 400MHZ 52QFN | 在線詢價 |
|
NB4N121KMNG | ON Semiconductor | IC CLK BUFFER 1:21 400MHZ 52QFN | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers