購買 MWI50-12E7與BYCHPS
購買即有保證
MWI50-12E7
- 型號:
- MWI50-12E7
- 製造商:
- IXYS Corporation
- 描述:
- MOD IGBT SIXPACK H-BRDG 1200V E2
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 14824 Pieces
- 數據表:
- MWI50-12E7.pdf
簡單介紹
BYCHIPS是 MWI50-12E7的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MWI50-12E7購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 集電極發射極擊穿（最大）: | 1200V |
|---|---|
| 的VCE（on）（最大）@ VGE，IC: | 2.4V @ 15V, 50A |
| 供應商設備封裝: | E2 |
| 系列: | - |
| 功率 - 最大: | 350W |
| 封裝/箱體: | E2 |
| 工作溫度: | -40°C ~ 125°C (TJ) |
| NTC熱敏電阻: | No |
| 安裝類型: | Chassis Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商零件編號: | MWI50-12E7 |
| 輸入電容（連鎖商店）@的Vce: | 3.8nF @ 25V |
| 輸入: | Standard |
| IGBT類型: | NPT |
| 展開說明: | IGBT Module NPT Three Phase Inverter 1200V 90A 350W Chassis Mount E2 |
| 描述: | MOD IGBT SIXPACK H-BRDG 1200V E2 |
| 電流 - 集電極截止（最大）: | 800µA |
| 電流 - 集電極（Ic）（最大）: | 90A |
| 組態: | Three Phase Inverter |
| Email: | [email protected] |
MWI50-12E7的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MWI50-12T7T | IXYS | MOD IGBT SIX-PACK RBSOA E2 | 在線詢價 |
 |
APTGT75DH60T1G | Microsemi Corporation | MOD IGBT 600V 100A SP1 | 在線詢價 |
 |
FS600R07A2E3B31BOSA1 | Infineon Technologies | IGBT MODULES | 在線詢價 |
|
MWI50-12E6K | IXYS | MOD IGBT SIXPACK RBSOA 1200V E1 | 在線詢價 |
|
VII50-12P1 | IXYS | MOD IGBT PHASE LEG 1200V ECOPAC2 | 在線詢價 |
|
MWI50-06A7 | IXYS | MOD IGBT SIXPACK RBSOA 600V E2 | 在線詢價 |
 |
APTGL180A1202G | Microsemi Corporation | POWER MOD IGBT4 PHASE LEG SP2 | 在線詢價 |
|
MWI50-12A7 | IXYS | MOD IGBT SIXPACK RBSOA 1200V E2 | 在線詢價 |
|
MWI50-12A7T | IXYS | MOD IGBT SIXPACK RBSOA 1200V E2 | 在線詢價 |
 |
MUBW10-06A7 | IXYS | CONVERTER/BRAKE/INVERTER 1.9VCE | 在線詢價 |
|
APTGF200A120D3G | Microsemi Corporation | IGBT MODULE NPT PHASE LEG D3 | 在線詢價 |
|
MWI50-06A7T | IXYS | MOD IGBT SIXPACK RBSOA 600V E2 | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers