購買 MPC5125YVN400R與BYCHPS
購買即有保證
MPC5125YVN400R
- 型號:
- MPC5125YVN400R
- 描述:
- IC MCU 32BIT ROMLESS 324TEPBGA
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 13407 Pieces
簡單介紹
BYCHIPS是 MPC5125YVN400R的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MPC5125YVN400R購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 電源（Vcc / VDD）: | 1.08 V ~ 3.6 V |
|---|---|
| 供應商設備封裝: | 324-TEPBGA (23x23) |
| 速度: | 400MHz |
| 系列: | MPC51xx |
| RAM容量: | 32K x 8 |
| 程序存儲器類型: | ROMless |
| 程序存儲器大小: | - |
| 外設: | DMA, WDT |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 324-BBGA |
| 其他名稱: | 935322285518 |
| 振盪器型: | External |
| 工作溫度: | -40°C ~ 125°C (TJ) |
| I / O數量: | 64 |
| 濕度敏感度（MSL）: | 3 (168 Hours) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | MPC5125YVN400R |
| 展開說明: | e300 MPC51xx Microcontroller IC 32-Bit 400MHz ROMless 324-TEPBGA (23x23) |
| EEPROM容量: | - |
| 描述: | IC MCU 32BIT ROMLESS 324TEPBGA |
| 數據轉換器: | - |
| 核心尺寸: | 32-Bit |
| 核心處理器: | e300 |
| 連通性: | CAN, EBI/EMI, Ethernet, I²C, USB OTG |
| Email: | [email protected] |
MPC5125YVN400R的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MPC5125YVN400 | NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | 在線詢價 |
 |
PIC17LC756AT-08I/L | Microchip Technology | IC MCU 8BIT 32KB OTP 68PLCC | 在線詢價 |
 |
MPC5123YVY400B | NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | 在線詢價 |
 |
TM4C1236H6PMI7 | Texas Instruments | IC MCU 32BIT 256KB FLASH 64LQFP | 在線詢價 |
|
MPC5123VY400B | NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | 在線詢價 |
 |
PIC18F24K40-I/SO | Microchip Technology | IC MCU 8BIT 16KB FLASH 28SOIC | 在線詢價 |
 |
PIC16LF1937-I/ML | Microchip Technology | IC MCU 8BIT 14KB FLASH 44QFN | 在線詢價 |
|
MPC5121VY400B | NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | 在線詢價 |
|
MPC5121YVY400B | NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | 在線詢價 |
|
TMS320F28068FPFPQ | Texas Instruments | IC MCU 32BIT 256KB FLASH 80HTQFP | 在線詢價 |
 |
PIC16LC54A-04E/P | Microchip Technology | IC MCU 8BIT 768B OTP 18DIP | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers