購買 MMZ0603F750ET000與BYCHPS
購買即有保證
MMZ0603F750ET000
- 型號:
- MMZ0603F750ET000
- 製造商:
- TDK Corporation
- 描述:
- FERRITE BEAD 75 OHM 0201 1LN
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 19688 Pieces
簡單介紹
BYCHIPS是 MMZ0603F750ET000的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MMZ0603F750ET000購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 尺寸/尺寸: | 0.024" L x 0.012" W (0.60mm x 0.30mm) |
|---|---|
| 系列: | MMZ-E |
| 評級: | - |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | 0201 (0603 Metric) |
| 其他名稱: | 445-172708-2 |
| 工作溫度: | -55°C ~ 125°C |
| 行數: | 1 |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 10 Weeks |
| 製造商零件編號: | MMZ0603F750ET000 |
| 頻率對應阻抗: | 75 Ohm @ 100MHz |
| 高度（最大）: | 0.013" (0.33mm) |
| 過濾器類型: | Signal Line |
| 描述: | FERRITE BEAD 75 OHM 0201 1LN |
| 直流電阻（DCR）（最大值）: | 2.6 Ohm |
| 卡厚度（mm）: | 125mA |
| Email: | [email protected] |
MMZ0603F750ET000的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers