購買 MMBZ4703-HE3-08與BYCHPS
購買即有保證
MMBZ4703-HE3-08
- 型號:
- MMBZ4703-HE3-08
- 描述:
- DIODE ZENER 16V 350MW SOT23-3
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 17404 Pieces
簡單介紹
BYCHIPS是 MMBZ4703-HE3-08的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MMBZ4703-HE3-08購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 電壓 - 齊納（標稱值）（VZ）: | 16V |
|---|---|
| 電壓 - 正向（Vf）（最大）: | - |
| 公差: | ±5% |
| 供應商設備封裝: | SOT-23-3 |
| 系列: | Automotive, AEC-Q101 |
| 功率 - 最大: | 350mW |
| 封装: | Tape & Reel (TR) |
| 封裝/箱體: | TO-236-3, SC-59, SOT-23-3 |
| 工作溫度: | -55°C ~ 150°C |
| 安裝類型: | Surface Mount |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | MMBZ4703-HE3-08 |
| 展開說明: | Zener Diode 350mW ±5% Surface Mount SOT-23-3 |
| 描述: | DIODE ZENER 16V 350MW SOT23-3 |
| 電流 - Vr時反向漏電: | 50nA @ 12.1V |
| Email: | [email protected] |
MMBZ4703-HE3-08的相似型號
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers