購買 MKP1847580354P4與BYCHPS
購買即有保證
MKP1847580354P4
- 型號:
- MKP1847580354P4
- 描述:
- CAP FILM 8UF 5% 700VDC RAD 4LD
- 無鉛狀態/ RoHS狀態:
- 無鉛/符合RoHS
- 庫存數量:
- 18514 Pieces
簡單介紹
BYCHIPS是 MKP1847580354P4的现货代理商，我們有庫存立即運輸，也可供長時間供應。請寄給我們您的MKP1847580354P4購買計劃通過電子郵件，我們會根據您的計劃給您最優惠的價格。
產品特性
| 額定電壓 - 直流: | 700V |
|---|---|
| 額定電壓 - AC: | 350V |
| 公差: | ±5% |
| 終止: | PC Pins |
| 尺寸/尺寸: | 1.693" L x 0.846" W (43.00mm x 21.50mm) |
| 系列: | MKP1847 |
| 封装: | Bulk |
| 封裝/箱體: | Radial - 4 Leads |
| 其他名稱: | BC2761 |
| 工作溫度: | -40°C ~ 85°C |
| 安裝類型: | Through Hole |
| 濕度敏感度（MSL）: | 1 (Unlimited) |
| 製造商標準交貨期: | 16 Weeks |
| 製造商零件編號: | MKP1847580354P4 |
| 引線間距: | 1.476" (37.50mm) |
| 高度 - 座高（最大）: | 1.516" (38.50mm) |
| 特徵: | Long Life |
| 展開說明: | 8µF ±5% Film Capacitor 350V 700V Polypropylene (PP), Metallized Radial - 4 Leads |
| ESR（等效串聯電阻）: | - |
| 絕緣材料: | Polypropylene (PP), Metallized |
| 描述: | CAP FILM 8UF 5% 700VDC RAD 4LD |
| 電容: | 8µF |
| 應用: | DC Link, DC Filtering; EMI, RFI Suppression; High Pulse, DV/DT |
| Email: | [email protected] |
MKP1847580354P4的相似型號
| 圖片 | 型號 | 製造商 | 描述 | 查看 |
|---|---|---|---|---|
 |
MKP1847580254P4 | Vishay BC Components | CAP FILM 8UF 5% 250VAC RAD 4LD | 在線詢價 |
|
MKP1847580444Y5 | Vishay BC Components | CAP FILM 8UF 5% 440VAC RAD 4LD | 在線詢價 |
|
MKP1847580234K2 | Vishay BC Components | CAP FILM 8UF 5% 230VAC RADIAL | 在線詢價 |
|
MKP1847580274P2 | Vishay BC Components | CAP FILM 8UF 5% 275VAC RADIAL | 在線詢價 |
|
MKP1847580254P2 | Vishay BC Components | CAP FILM 8UF 5% 250VAC RADIAL | 在線詢價 |
|
MKP1847580444Y2 | Vishay BC Components | CAP FILM 8UF 5% 440VAC RADIAL | 在線詢價 |
|
MKP1847580354P2 | Vishay BC Components | CAP FILM 8UF 5% 350VAC RADIAL | 在線詢價 |
|
MKP1847580314P2 | Vishay BC Components | CAP FILM 8UF 5% 310VAC RADIAL | 在線詢價 |
|
MKP1847580274P4 | Vishay BC Components | CAP FILM 8UF 5% 275VAC RAD 4LD | 在線詢價 |
|
MKP1847580314P4 | Vishay BC Components | CAP FILM 8UF 5% 310VAC RAD 4LD | 在線詢價 |
|
MKP1847580254K2 | Vishay BC Components | CAP FILM 8UF 5% 250VAC RADIAL | 在線詢價 |
最新資訊
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers